tag: 2.5D

What Happened To 450mm?
By The SE Staff - 17 Jul, 2014 - Comments: 1

By Mark LaPedus, Ed Sperling & Katherine Derbyshire There was a time not very long ago—one process node, in fact—when the economic momentum of Moore’s Law seemed unstoppable with a combination of extreme ultraviolet lithography, larger wafer sizes and a variety of new materials. Shrinking feature sizes is still technically possible, but certainly not with the same promised economic benef... » read more

All Roads Point Up…But When?
By Ed Sperling - 17 Jul, 2014 - Comments: 0

One of the clear messages at Semicon West this month was that stacked die are coming soon. The only question is how soon. This isn’t so simple to answer. It depends on a lot of factors, and for most of them there aren’t any clear answers. First of all, no one is certain what the cost equation will look like at 14/16nm, particularly once the process technology becomes more mature. Ther... » read more

After Moore’s Law: More With Less
By Brian Bailey - 10 Jul, 2014 - Comments: 6

In the decades when Moore’s Law went unquestioned, the industry was able to migrate to the next smaller node and receive access to more devices that could be used for increased functionality and additional integration. While less significant transistor-level power savings have been seen from the more recent nodes, as leakage currents have increased, the additional levels of integration have b... » read more

Stacked Die Are Coming Soon. Really
By Ed Sperling - 10 Jul, 2014 - Comments: 3

Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of building stacked die since last year, with risk production expected to be completed by year, according to Gartner. But something very fundament... » read more

Can EDA Keep Growing?
By Ed Sperling - 26 Jun, 2014 - Comments: 0

Slower progress at the leading edge of process technology, coupled with rising costs and fewer design starts, are changing the economics of the EDA world. Not surprisingly, there is almost a direct correlation between the shrinking number of startups in the field and the number of customers working on the most advanced nodes. So what exactly does this mean for the EDA world? Big changes, for... » read more

Manufacturing Bits: June 24
By Mark LaPedus - 24 Jun, 2014 - Comments: 0

A cup of sub-wavelength images The National Institute of Standards and Technology (NIST) and the University of Michigan have developed a technology that could enable sub-wavelength images at radio frequencies. Researchers used a mere glass cup, and laser light at optical wavelengths, to measure and image RF fields. In the future, this technology could measure the behavior of metamaterials. ... » read more

Mobile Packaging Market Heats Up
By Mark LaPedus - 19 Jun, 2014 - Comments: 0

Apple, Samsung and others are developing the next wave of smartphones and tablets. OEMs want to cram more chip functions in smaller IC packages, but there are some challenges in the arena. In fact, there are signs that the mainstream packaging technology for mobiles is running out of steam. For some time, mobile products have incorporated a technology called package-on-package (PoP), which u... » read more

Test Challenges Grow
By Mark LaPedus - 09 Jun, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss current and future test challenges with Dave Armstrong, director of business development at Advantest; Steve Pateras, product marketing director for Silicon Test Solutions at Mentor Graphics; Robert Ruiz, senior product marketing manager at Synopsys; Mike Slessor, president of FormFactor; and Dan Glotter, chief executive of Optimal+. SE: In our l... » read more

Executive Insight: Simon Segars
By Ed Sperling - 03 Jun, 2014 - Comments: 0

SE: What concerns you most? Segars: In the context of design and where chip design is going, ARM is a long-term business. We’re doing stuff now that is going to ship in five years’ time. Obviously, for everyone in this space, Moore’s Law has been a fantastic thing. It’s enabled us to achieve really fantastic scaling of transistors, and everyone knows that is getting harder and harder... » read more

Executive Insight: Hossein Yassaie
By Ed Sperling - 28 May, 2014 - Comments: 1

SE: What concerns you looking out at the semiconductor industry? Yassaie: There are big changes in the industry over the last two years, such as the verticalization in the mobile space. Every semiconductor company wanted to play in mobile. It was just a fact of life that some of these guys would give up. That was a major change, and it was something we could see coming. Our focus is diverse ... » read more

← Older posts Newer posts →

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy