tag: 3D

Manufacturing Bits: April 28
By Mark LaPedus - 28 Apr, 2015 - Comments: 0

CIA and 3D printers Voxel8, a supplier of 3D printers, has closed a strategic investment and technology development agreement with In-Q-Tel (IQT), the venture capital arm of the U.S. Central Intelligence Agency (CIA). Voxel8, founded by technologists from Harvard University, is commercializing a new platform for 3D printing. The company enables engineers to create products with embedded 3D ... » read more

Analysis: Applied-TEL Scrap Merger
By Mark LaPedus - 27 Apr, 2015 - Comments: 0

After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. It appears that the U.S. Department of Justice (DoJ) stepped in and blocked the deal. Now that the deal has been terminated, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as fierce compe... » read more

5 Issues Under The Foundry Radar
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

In the foundry business, the leading-edge segment grabs most, if not all, of the headlines. Foundry vendors, of course, are ramping up 16nm/14nm finFET processes, with 10nm and 7nm in R&D. The leading-edge foundry business is sizable, but it’s not the only thing going on in the competitive arena. In fact, there are battles taking place in many other foundry segments, such as 2.5D/3D packag... » read more

Manufacturing Bits: April 14
By Mark LaPedus - 14 Apr, 2015 - Comments: 0

Monster waves of light The FOM Institute AMOLF has observed what researchers call monster waves of light. In this phenomenon, monster waves of light appear from nowhere and then disappear again. Researchers have shown that it is possible to influence the probability of this phenomenon. As a result, the technology could lead to faster telecommunication systems or more sensitive sensors, acco... » read more

Manufacturing Bits: March 17
By Mark LaPedus - 17 Mar, 2015 - Comments: 0

EUV source firm seeks help In 2012, a startup called Zplasma came out of stealth mode and introduced its first technology—a next-generation power source for extreme ultraviolet (EUV) lithography. But after much fanfare and hope, Zplasma has been unable to commercialize its EUV source technology. The company has also been unable to attract a development partner or outside funding. And t... » read more

Manufacturing Bits: March 10
By Mark LaPedus - 10 Mar, 2015 - Comments: 0

Hi-tech pens The University of California at San Diego has developed a hi-tech ballpoint pen. Researchers have taken off-the-shelf ballpoint pens and filled them with bio inks. With so-called enzymatic-ink-based roller pens, users are able to draw biocatalytic sensors on a surface. [caption id="attachment_18297" align="alignleft" width="300"] Researchers draw sensors capable of detecting... » read more

Manufacturing Bits: Feb. 24
By Mark LaPedus - 24 Feb, 2015 - Comments: 0

EUV progress report At the SPIE Advanced Lithography conference in San Jose, Calif., ASML Holding said that one customer, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has exposed more than 1,000 wafers on an NXE:3300B EUV system in a single day. This is one step towards the insertion of EUV lithography in volume production. During a recent test run on the system, TSMC exposed 1,022 w... » read more

Fab Tool R&D And Ramen Noodles
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

The semiconductor equipment and materials industry has always been a tough business. Over the years, vendors have been under pressure to develop new technologies for a shrinking but demanding customer base. And as a result, many vendors could not keep up, or elected to exit the business, causing a massive shakeout in the industry. It isn’t getting any easier, though. Today, tool and... » read more

Manufacturing Bits: Jan. 20
By Mark LaPedus - 20 Jan, 2015 - Comments: 0

Batman chips The demand for faster and higher-density storage has prompted researchers to look for ways to control the magnetic states of tiny magnets. Seeking to improve the magnetic recording speeds and spatial resolutions in structures, Radboud University and others attempted to switch the magnetization in microstructures by using a femtosecond laser pulse. The laser light did not switch... » read more

Manufacturing Bits: Jan. 13
By Mark LaPedus - 13 Jan, 2015 - Comments: 0

Pop-up 3D printing Northwestern University and the University of Illinois at Urbana-Champaign have developed a new “pop-up” printing technique to make 3D structures down to 100nm. The technique has advantages over today’s 3D printing, which is creating a lot of buzz, if not hype, in the market. Researchers from Northwestern and Illinois devised a printing technique that mimics the act... » read more

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