tag: AI

Week In Review: Design, Low Power
By Jesse Allen - 19 Oct, 2018 - Comments: 0

Arm announced its new roadmap promising 30% annual system performance gains on leading edge nodes through 2021. These gains are to come from a combination of microarchitecture design to hardware, software and tools. They are branding this new roadmap 'Neoverse.' The first delivery will be Ares – expected in early 2019 – for a 7nm IP platform targeting 5G networks and next-generation cloud t... » read more

Wanted: Mask Equipment for Mature Nodes
By Mark LaPedus - 18 Oct, 2018 - Comments: 0

Rising demand for chips at mature nodes is impacting the photomask supply chain, causing huge demand for trailing-edge masks and a shortfall of older mask equipment. The big issue is the equipment shortfall, which could impact customers on several fronts. Tool shortages could lead to longer mask turnaround times and delivery schedules for chips being developed at 90nm and above, which are bu... » read more

Looking For The Next Big Innovation
By Buvna Ayyagari-Sangamalli - 18 Oct, 2018 - Comments: 0

Never has there been more demand for “The Big Innovation” — one that moves the needle for performance, power and area-cost (PPAC) in a big way — as there is in the current era of AI and machine learning (ML). As summarized in Why AI Workloads Require New Computing Architectures, AI workloads require new architectures to process data. These workloads also call for heterogeneous comp... » read more

Machine Learning Invades IC Production
By Mark LaPedus - 18 Oct, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss artificial intelligence (AI), machine learning, and chip and photomask manufacturing technologies with Aki Fujimura, chief executive of D2S; Jerry Chen, business and ecosystem development manager at Nvidia; Noriaki Nakayamada, senior technologist at NuFlare; and Mikael Wahlsten, director and product area manager at Mycronic. What follows are excerpt... » read more

RISC-V: More Than a Core
By Brian Bailey - 15 Oct, 2018 - Comments: 2

The open-source RISC-V instruction set architecture (ISA) is attracting a lot of attention across the semiconductor industry, but its long-term success will depend on levels of cooperation never seen before in the semiconductor industry. The big question now is how committed the industry is to RISC-V's success. The real value that RISC-V brings is the promise of an ecosystem and the opportun... » read more

Adding AI To The IoT
By Ed Sperling - 12 Oct, 2018 - Comments: 2

The Internet of Things is about to undergo a radical change, fueled by vast number of things coupled with an almost pervasive presence of AI. The IoT today encompasses a long list of vertical markets, all of them connected to the Internet but not necessarily to each other. The concept of the IoT really began taking off in 2015, when a combination of data analytics, high-speed, affordable and... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 12 Oct, 2018 - Comments: 0

Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Making AI Run Faster
By Ed Sperling - 11 Oct, 2018 - Comments: 0

The semiconductor industry has woken up to the fact that heterogeneous computing is the way forward and that inferencing will require more than a GPU or a CPU. The numbers being bandied about by the 30 or so companies working on this problem are 100X improvements in performance. But how to get there isn't so simple. It requires four major changes, as well as some other architectural shifts. ... » read more

Reliability, Machine Learning And Advanced Packaging
By Ed Sperling - 11 Oct, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows ar... » read more

Using ASICs For AI Inferencing
By Ed Sperling - 10 Oct, 2018 - Comments: 0

Flex Logix’s Cheng Wang looks at why ASICs are the best way to improve performance and optimize power and area for inferencing, and how to add flexibility into those designs to deal with constantly changing algorithms and data sets. https://youtu.be/XMHr7sz9JWQ » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy