Blog Review: Apr. 15


Cadence's Wilson Kobalkar shares why eUSB2‑V2 represents a major evolutionary step for the USB 2.0 ecosystem, including how it achieves multi‑gigabit HSx operation and why symmetric/asymmetric modes unlock new design possibilities. Synopsys' Akanksha Soni explains the difference between metal-oxide-metal, metal-insulator-metal, and metal-oxide-semiconductor capacitors, identifying the ad... » read more

A New Era For Co-Processing


Key Takeaways: There is no single processor capable of executing everything efficiently, meaning that multiple processors are required. Maximum efficiency is gained by minimizing the movement of data. Architects must maximize efficiency for today's workloads, while also adding enough flexibility to handle tomorrow's. New processor architectures are rapidly evolving thanks to... » read more

Fast Isn’t Fast Enough: Redefining Metrics for Edge AI


Key Takeaways: Edge AI performance is about low latency and power efficiency, not peak TOPS. Memory bandwidth and data movement now limit edge AI more than compute. Successful edge AI requires balanced hardware, software, and fast model updates. Experts At The Table: Today’s chip architect must contend with multiple factors when architecting AI processors for fast and effi... » read more

Redefining AI Inference With New Silicon Architecture


AI inference is rapidly becoming the largest and most demanding segment of the AI market, but the cost of running these workloads continues to be a major challenge. VSORA, a fabless semiconductor company, is tackling this problem head-on with a fresh approach to high‑performance AI processing and a deep collaboration with Cadence. VSORA develops advanced AI chips that dramatically reduce t... » read more

Engineer’s Guide to Simulating Electronics Cooling: eBook


Struggling with overheating PCBs, airflow bottlenecks, or long thermal simulation runtimes? As power densities rise and form factors shrink, electronics cooling is no longer a late-stage check — it’s a core design requirement. Poor thermal performance leads to hotspots, reduced reliability, field failures, and costly redesigns. Learn how to use intelligent thermal simulation to predic... » read more

Blog Review: Apr. 8


Cadence's Shyam Sharma highlights new capabilities in LPDDR6, including metadata built into the data packets, rowhammer mitigations, DVFS with support for three operating voltage rails, and new efficiency modes. Synopsys' Akanksha Soni points to multiphysics simulation as a key element of ensuring automotive IC designs meet ISO 26262 requirements. Siemens' John McMillan suggests a simulat... » read more

Reinventing Embedded Memory: Solving The SRAM Scaling Wall


As AI, automotive, and data centers continue to scale exponentially, one part of the chip has quietly become a bottleneck: embedded memory. Modern designs now dedicate more than half of their silicon area to SRAM, yet SRAM no longer scales with Moore's law in advanced CMOS nodes. The result? Larger chips, higher power, and rising costs. RAAAM is a deep-tech startup spun out of Bar-Ilan Unive... » read more

IC Security Threats Spike With Quantum, AI, And Automotive


Key Takeaways: The top challenge for the chip architect is building post‑quantum cryptography securely into real hardware from the start, not just selecting approved algorithms. Security must be treated as a core silicon architecture decision early on, especially for long‑lived, automotive, and multi‑vendor systems. Automotive cybersecurity now requires a holistic approach span... » read more

The One Bit Problem That Can Break a System


Key Takeaways: Bit flipping is no longer a rare reliability issue but a systemic risk driven by shrinking process nodes, higher clock speeds, lower voltages, and radiation exposure, leading to silent data corruption and potential system failure. The same mechanisms that cause accidental bit flips can be deliberately exploited through techniques such as clock, voltage, laser, and rowhamm... » read more

Radar SLAM Application on Vision DSPs based on Novel IO-ICP


With the increasing use of vision, radar and LiDAR in autonomous vehicles, robots, drones, and augmented reality, there is a greater demand for the capability and performance of multimodal sensing applications. This demand requires sophisticated multi-sensing algorithms and powerful digital signal processors (DSPs) to run them. Simultaneous localization and mapping (SLAM) has revolutionized ... » read more

← Older posts Newer posts →