tag: EUV

Research Bits: June 23
By Jesse Allen - 23 Jun, 2026 - Comments: 0

Redesigning high-NA EUV A researcher from the Okinawa Institute of Science and Technology (OIST) proposes redesigning the illumination systems and projectors used in high-NA EUV lithography to reduce optical effects and enhance resolution. In the proposed projector design, the collector mirrors in the illumination system have a simpler design to bring short wavelengths of light from the EUV... » read more

Mask Economics Shape High-NA EUV Adoption
By Gregory Haley - 22 Jun, 2026 - Comments: 0

Key Takeaways: Mask costs are not stopping leading-edge scaling, but they increasingly influence design, node, and process choices. High-NA EUV will tighten requirements for CD, EPE, local CDU, mask 3D modeling, stitching, and materials. Reduced depth of focus in High-NA EUV will drive new resist, etch, film, and absorber approaches. Experts at the table: Semiconductor Engin... » read more

Research Bits: Jun. 2
By Jesse Allen - 02 Jun, 2026 - Comments: 1

Integrated valleytronics device Researchers from Monash University designed a valleytronics circuit that can generate, direct, and read light-based information on a single chip. Potential applications include quantum computing, advanced imaging, and optical communication systems. “We employ a straightforward stacking approach to integrate ultrathin materials with metasurfaces, overcoming ... » read more

Curvilinear Masks Push The Limits Of Inspection And Metrology
By Gregory Haley - 27 May, 2026 - Comments: 0

Key Takeaways: Curvilinear masks require native data flows across design, mask data prep, writing, inspection, and metrology. Inspection is shifting from finding all defects to identifying which mask variations actually print on wafer. High-NA EUV will intensify inspection challenges, particularly for small printable defects and actinic contrast limits. Experts at the table... » read more

Mask Technology Faces A New Set Of Challenges
By Gregory Haley - 21 May, 2026 - Comments: 0

Key Takeaways: Mask inspection and repair remain the critical bottleneck, even as multi-beam writers have reduced mask-writing constraints. Curvilinear masks are becoming viable for critical layers, but qualification, metrology, and inspection standards still lag production needs. Scaling curvilinear requires curvilinear-native data flows, model-based checks, GPU/HPC compute, and les... » read more

eBeam Initiative At SPIE ALP 2026: Continuing Progress On Curvilinear, EUV, And Data Challenges
By Jan Willis - 16 Apr, 2026 - Comments: 0

The eBeam Initiative’s annual lunch at SPIE Advanced Lithography and Patterning has long served as a focal point for eBeam technology education for the industry. This year marked our 17th gathering, with approximately 150 attendees joining us. As in past years, the value of the session was less about any single topic and more about the collective signal across different parts of the ecosystem... » read more

Study of EUV Nanostructures Using AFM With High-Aspect Ratio Tip (Purdue, Intel, Bruker)
By Technical Paper Link - 11 Apr, 2026 - Comments: 0

A new technical paper, "Characterizing tip-sample interaction dynamics on extreme ultraviolet nanostructures using atomic force microscopy with a high-aspect ratio tip," was released by researchers at Purdue University, Intel Corporation and Bruker Corporation. Abstract "Accurate measurements of the nanometer scale geometry of extreme ultraviolet (EUV) lithography photoresist patterns are... » read more

Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography + Patterning 2026
By Travis Brist - 19 Mar, 2026 - Comments: 0

Leading‑edge system-on-chip (SoC) designs at deep submicron nodes are stretching lithography and patterning capabilities across the entire manufacturing flow. Extreme ultraviolet (EUV) lithography has become central to printing advanced features, using high‑power pulsed lasers to generate a plasma light source and reflective optics to project mask patterns onto the wafer. As error budgets t... » read more

Expert Panel Sees History Of Continuous Photomask Innovations As Key To The Future
By Jan Willis - 27 Oct, 2025 - Comments: 0

The eBeam Initiative conducted its 14th annual eBeam Initiative Luminaries survey in July and reported the results on September 23, 2025 to more than 200 attendees at its annual meeting during the BACUS SPIE Photomask Technology conference. Industry luminaries representing 51 companies from across the semiconductor ecosystem—including photomasks, electronic design automation (EDA), chip desig... » read more

Charting The Frontiers Of Photomask Technology And Extreme Ultraviolet Lithography
By Travis Brist - 23 Oct, 2025 - Comments: 0

The enormous computing demands of AI and high-performance computing (HPC) applications are putting intense pressure on every aspect of chip development. Challenges arise during architecture, design, and verification, persist through the manufacturing process, and extend to post-silicon lifecycle management as chips are deployed in the field. Lithography, the fabrication step of shining light... » read more

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