tag: Synopsys

New Antennas And Advanced ICs Needed For 6G
By Liz Allan - 15 Sep, 2025 - Comments: 1

6G is expected to bring data speeds that enable highly integrated and responsive technology in smartphones, homes, cities, and autonomous vehicles, but realizing that goal will require a lot more work. There will be many more antennas everywhere, embedded in infrastructure around town, in base stations, edge-devices, and everything in between. They will be sending and receiving many more sig... » read more

Chip Industry Week in Review
By The SE Staff - 12 Sep, 2025 - Comments: 0

The U.S. is considering annual approvals for Samsung and SK hynix to export chipmaking tools and materials to their factories in China, replacing perpetual waivers granted under the validated end user system, reports Bloomberg. The proposal, presented by the U.S. Commerce Department to South Korean officials, would require the companies to reapply each year for specific quantities of restricted... » read more

Balancing Workloads In AI Processor Designs
By Ann Mutschler - 11 Sep, 2025 - Comments: 0

A growing number of AI processors are being designed around specific workloads rather than standardized benchmarks, optimizing performance and power efficiency, but often with enough flexibility to adapt to future changes. While the fundamentals of matrix multiplication and software optimization still apply, those alone are no longer sufficient. Designs need to address specific data types, w... » read more

Coloring Optical Signals For More Bandwidth In Data Centers
By Bryon Moyer - 11 Sep, 2025 - Comments: 1

Copper cabling has been the workhorse for moving data inside of AI and HPC data centers, but fiber is nipping at its heels. Optics brings three possible bandwidth multipliers — wavelength-division multiplexing (WDM), the use of different modes, and polarization. Each has a role in longer-distance optical links, but the tradeoffs are different in the data center. WDM appears poised to boost... » read more

The Demise Of Static Timing Verification?
By Brian Bailey - 11 Sep, 2025 - Comments: 0

The chip industry traditionally has relied on margins to help them mitigate timing problems, but an increasing array of factors are now influencing timing. Can static timing analysis evolve to address these problems? Static timing verification (STA) was a cornerstone technology for the acceptance of the register transfer level (RTL) abstraction. It showed that functionality would not be impa... » read more

Blog Review: Sept. 10
By Jesse Allen - 10 Sep, 2025 - Comments: 0

Cadence's Satish Kumar C explains Port-Based Routing, a feature in in CXL 3.0 and 3.1 that changes how CXL switches operate within a CXL fabric to enable the creation of much larger, more flexible, and more efficient topologies. Siemens' Bill Hargin demystifies copper foil thickness and weight measurements and why being precise has an impact on signal integrity and crosstalk simulations.... » read more

A Lens Designer’s View Of Metaoptics: Aberration Theory For Flat Optics
By Synopsys - 10 Sep, 2025 - Comments: 0

By Dr. John R. Rogers and Dr. Yijin Ding. This paper covers a discussion of the Abbe Sine Condition and its implication for Flat Optics, including the effects of stop shift and substrate curvature. Following that, we apply Sweatt’s high index model of diffractive effects to develop a third-order aberration theory for diffractive, meta-, and hybrid optical systems, including the pos... » read more

Making The Most of Test Resources
By Laura Peters - 09 Sep, 2025 - Comments: 0

Semiconductor testing is undergoing multiple paradigm changes at once with the common goals of producing more known good die per month with low test cost. Achieving these goals requires a delicate balance between yield, quality, and test times. There are multiple ways to go about making better use of existing resources, many of which involve an increasing use of design for test (DFT) methods... » read more

Monitor, Test, And Repair For Multi-Die Health And Reliability
By Yervant Zorian - 09 Sep, 2025 - Comments: 0

Ever since the earliest semiconductor devices, silicon health has been a concern. Systems manufacturers wanted to be sure that their chips worked properly before being soldered onto printed circuit boards (PCBs). They put pressure on semiconductor suppliers to test wafers, individual dies, and assembled parts before they were shipped. A wide range of design-for-test (DFT) approaches were develo... » read more

Infusing Trust Into The Supply Chain
By Anne Meixner - 09 Sep, 2025 - Comments: 0

An expanding supply chain of dies feeding multi-die products is prompting chipmakers to reassess and expand on ways to instill trust from end to end. This reaches deeper than just connecting disparate data. It requires integrating complex systems across vendors and protecting vendor data while instilling confidence in their customers and partners. Yet despite the time and effort that has bee... » read more

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