tag: advanced packaging

The Race To Mass Customization
By Ed Sperling - 09 Apr, 2018 - Comments: 0

The number of advanced packaging options continues to rise. The choices now include different materials for interposers, at least a half-dozen fan-outs, not to mention hybrid fan-out/3D stacking, system-in-package, flip-chip and die-to-die bridges. There are several reasons for all of this activity. First, advanced packaging offers big improvements in performance and power that cannot be ac... » read more

Choosing The Right Interconnect
By Ed Sperling - 09 Apr, 2018 - Comments: 3

Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

AI: The Next Big Thing
By Ed Sperling - 15 Mar, 2018 - Comments: 2

The next big thing isn't actually a thing. It's a set of finely tuned statistical models. But developing, optimizing and utilizing those models, which collectively fit under the umbrella of artificial intelligence, will require some of the most advanced semiconductors ever developed. The demand for artificial intelligence is almost ubiquitous. As with all "next big things," it is a horizonta... » read more

The Next 5 Years Of Chip Technology
By Ed Sperling - 14 Mar, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of Lam Research; Mark Dougherty, vice president of advanced module engineering at GlobalFoundries; David Shortt, technical fellow at KLA-Tencor; Gary Zhang, vice president of computational litho products at ASML; and Shay... » read more

Is Advanced Packaging The Next SoC?
By Ed Sperling - 05 Mar, 2018 - Comments: 1

Device scaling appears to be possible down to 1.2nm, and maybe even beyond that. What isn't obvious is when scaling will reach that node, how many companies will actually use it, or even what chips will look like when foundries actually start turning out these devices using multi-patterning with high-NA EUV and dielectrics with single-digit numbers of atoms. There are two big changes playing... » read more

Chip Aging Accelerates
By Ed Sperling - 14 Feb, 2018 - Comments: 1

Reliability is becoming an increasingly important proof point for new chips as they are rolled out in new markets such as automotive, cloud computing and industrial IoT, but actually proving that a chip will function as expected over time is becoming much more difficult. In the past, reliability generally was considered a foundry issue. Chips developed for computers and phones were designed ... » read more

Follow The Moving Money
By Ed Sperling - 18 Jan, 2018 - Comments: 1

Semiconductor economics are changing by market, by region, and by product node and packaging type, adding new complexity into decisions about which technology to use for which products and why. Money is the common denominator in all of these decisions, whether it's measured by return on invested capital, quarterly profits, or long-term investments that can include acquisitions, organic growt... » read more

Predictions: Manufacturing, Devices And Companies
By Brian Bailey - 18 Jan, 2018 - Comments: 0

Some predictions are just wishful thinking, but most of these are a lot more thoughtful. They project what needs to happen for various markets or products to become successful. Those far reaching predictions may not fully happen within 2018, but we give everyone the chance to note the progress made towards their predictions at the end of the year. (See Reflection On 2017: Design And EDA and Man... » read more

Warp Speed Ahead
By Ed Sperling - 11 Jan, 2018 - Comments: 3

The computing world is on a tear, but not just in one direction. While battery-powered applications are focused on extending the time between charges or battery replacements, there is a whole separate and growing market for massive improvements in speed. Ultimately, this is where quantum computing will play a role, probably sometime in the late 2020/early 2030 timeframe, according to multipl... » read more

Advanced Packaging Still Not So Simple
By Ed Sperling - 08 Jan, 2018 - Comments: 1

The promise of advanced packaging comes in multiple areas, but no single packaging approach addresses all of them. This is why there is still no clear winner in the packaging world. There are clear performance benefits, because the distance between two chips in a package can be significantly shorter than the distance that signals have to travel from one side of a die to another. Moreover, wi... » read more

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