tag: ANSYS

Blog Review: Nov. 1
By Jesse Allen - 01 Nov, 2017 - Comments: 0

Mentor's Nitin Bhagwath continues digging into DDR timing with a look at the clock-to-DQS requirement at the DRAM and how "write-leveling" is used to solve layout issues caused by the requirement. Synopsys' Dipesh Handa checks out what's new in the MIPI CSI-2 v2.0 specification that opens it up to new imaging and vision applications, including IoT and automotive. Cadence's Ken Willis delv... » read more

The Week In Review: Design
By Jesse Allen - 27 Oct, 2017 - Comments: 0

M&A PLDA is divesting its Reflex CES brand. The FPGA board maker will become wholly managed by its own management and investment teams. In 2015, Reflex CES took over the hardware businesses of PLDA, including FPGA-based boards and the System-on-Module product lines. Tools Mentor uncorked a new tool for in-system test and diagnosis of automotive ICs. Tessent MissionMode provides infrast... » read more

Blog Review: Oct. 25
By Jesse Allen - 25 Oct, 2017 - Comments: 0

Mentor's Joe Hupcey III explains the benefits of prioritizing faults with formal analysis before launching detailed fault verification. Cadence's Paul McLellan listens in as AMD's Mark Papermaster discusses what's needed to keep driving Moore's Law. Synopsys' Jesse Victors takes a look at ROCA, the latest flaw affecting RSA cryptography, and argues it may be time for a new encryption sche... » read more

Improving Automotive Reliability
By Annapoorna Krishnaswamy - 16 Oct, 2017 - Comments: 0

Semiconductor reliability requirements are rapidly evolving. New applications such as ADAS/self-driving cars and drones are pushing the limits for system reliability. A mobile phone that overheats in your pocket is annoying. In automobiles, it's a much different story. Overheating can impact the operation of backup sensors, which alert the driver that a pedestrian or obstacle is behind them.... » read more

New Power Concerns At 10/7nm
By Ann Mutschler - 16 Oct, 2017 - Comments: 1

As chip sizes and complexity continues to grow exponentially at 7nm and below, managing power is becoming much more difficult. There are a number of factors that come into play at advanced nodes, including more and different types of processors, more chip-package decisions, and more susceptibility to noise of all sorts due to thinner insulation layers and wires. The result is that engineers ... » read more

Noise Abatement
By Brian Bailey - 12 Oct, 2017 - Comments: 0

[getkc id="285" kc_name="Noise"] is a fact of life. Almost everything we do creates noise as a by-product and quite often what is a signal to one party is noise to another. Noise cannot be eliminated. It must be managed. But is noise becoming a larger issue in chips as the technology nodes get smaller and packaging becomes more complex? For some, the answer is a very strong yes, while for ot... » read more

Strategic Value Of High-Performance Computing For Research And Innovation
By Ansys - 11 Oct, 2017 - Comments: 0

High-performance computing (HPC) is an enormous part of the present and future of engineering simulation. HPC enables engineers and researchers to gain high-fidelity insight into product behavior — insight that cannot be obtained without detailed simulation models. When applied to design exploration, HPC can lead to robust product performance and reduced warranty and maintenance costs. Wim Sl... » read more

Blog Review: Oct. 11
By Jesse Allen - 11 Oct, 2017 - Comments: 0

Mentor's Matthew Balance examines the separation of concerns between test intent and test realization in the Portable Stimulus specification. Synopsys' Deepak Nagaria checks out the features that makes LPDDR4 efficient in terms of power consumption, bandwidth utilization, data integrity and performance. Cadence's Meera Collier listens in as Chris Rowen considers whether AI processing shou... » read more

What’s Next for the IoT?
By Jeff Dorsch - 05 Oct, 2017 - Comments: 0

The Internet of Things continues to evolve, attempting to overcome its poor reputation for cybersecurity and making the case for wider adoption, especially by enterprises. Consumer IoT, largely represented in smart-home automation, remains a market being targeted by Amazon, Apple, Google, LG Electronics, Samsung Electronics, and other technology titans. The big bucks are in [getkc id="78" k... » read more

Blog Review: Oct. 4
By Jesse Allen - 04 Oct, 2017 - Comments: 0

Synopsys' Prishkrit Abrol digs into how USB Type-C Alternate Mode allows MHL, DisplayPort, HDMI, and Thunderbolt over cable. Mentor's Paul Morrison dives into how hardware emulation can help verify the complexities of new storage devices. Cadence's Madhavi Rao listens in as Somshubhro Pal Choudhury of Bharat Innovations describes the IoT stack, hype cycle, and why it's happening now. R... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy