tag: Applied Materials

New Applications Call For New Memory Types
By Sean SK Kang - 20 Jun, 2019 - Comments: 0

The semiconductor industry is on the verge of a transformative computing era driven by Big Data, Artificial Intelligence (AI) and the Internet of Things (IoT). However, achieving the improvements in computing performance and efficiency needed for new AI and IoT applications represent some of the biggest technology challenges the industry has faced. Among the most critical requirements is del... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Jun, 2019 - Comments: 0

Market research In the second quarter of 2019, TrendForce said that the top-5 foundry rankings remained identical with that of last year. But sixth to tenth place showed some changes. Who is up or down in what is a tough business climate? Global fab equipment spending will rebound in 2020, growing 20% to $58.4 billion after dropping 19% to $48.4 billion in 2019, according to SEMI. However, ... » read more

Inspection, Metrology Challenges Grow For SiC
By Mark LaPedus - 11 Jun, 2019 - Comments: 2

Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

MicroLEDs: The Next Revolution In Displays?
By Mark LaPedus - 29 May, 2019 - Comments: 1

Flat-panel display technology is exploding on several fronts as more screens are required for more devices. But one type of display is generating an enormous amount of buzz in the market—microLEDs. Dozens of companies are working on micro-light emitting diodes (microLEDs), a technology that promises to provide better and brighter displays than current solutions in the market. Apple, Facebo... » read more

SiC Demand Growing Faster Than Supply
By Mark LaPedus - 23 May, 2019 - Comments: 2

The silicon carbide (SiC) industry is in the midst of a major expansion campaign, but suppliers are struggling to meet potential demand for SiC power devices and wafers in the market. In just one example of the expansion efforts, Cree plans to invest up to $1 billion to increase its SiC fab and wafer capacities. As part of the plan, Cree is developing the world’s first 200mm (8-inch) SiC f... » read more

New Imaging Tech Finds Buried Defects
By Shinsuke Mizuno - 23 May, 2019 - Comments: 0

By Shinsuke Mizuno and Vadim Kuchik Defects and contamination on the wafer can slow process development times and limit performance and yield. As chips get more complex, more defects can become buried within the increasing number of layers in the design. Finding and analyzing these buried defects is a major challenge for the industry, especially during the early learning cycles of new manufa... » read more

3D NAND Race Faces Huge Tech And Cost Challenges
By Mark LaPedus - 23 May, 2019 - Comments: 8

Amid the ongoing memory downturn, 3D NAND suppliers continue to race each other to the next technology generations with several challenges and a possible shakeout ahead. Micron, Samsung, SK Hynix and the Toshiba-Western Digital duo are developing 3D NAND products at the next nodes on the roadmap, but the status of two others, Intel and China’s Yangtze Memory Technologies Co. (YMTC), is les... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 May, 2019 - Comments: 0

Market research In terms of overall IC sales, Intel has replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17, according to IC Insights. “While Samsung held the full-year number one ranking in 2017 and 2018, Intel is forecast to easily recapture the number one ranking for the full-year of 2019, a position it previously held ... » read more

EUV Mask Gaps And Issues
By Mark LaPedus - 08 May, 2019 - Comments: 1

Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and photomask technologies with Emily Gallagher, principal member of the technical staff at Imec; Harry Levinson, principal at HJL Lithography; Chris Spence, vice president of advanced technology development at ASML; Banqiu Wu, senior director of process development at Applied Materials; and Aki Fujimura, chief ... » read more

Blog Review: May 8
By Jesse Allen - 08 May, 2019 - Comments: 0

Synopsys' Taylor Armerding warns that the threat of cyber war on the financial system is a real possibility and points to four major vulnerability concerns. Cadence's Meera Collier takes a look at bees and technology, from smart hives to sensors that can be carried on the insects' backs. Mentor's Brent Klingforth argues that electrical and mechanic designers need to seamlessly share infor... » read more

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