tag: Applied Materials

Experts At The Table: MEMS Challenges
By Mark LaPedus - 13 Dec, 2013 - Comments: 1

Semiconductor Engineering sat down to discuss the challenges of MEMS with Rakesh Kumar, senior director of the MEMS program at GlobalFoundries; Tak Tanaka, managing director for Applied Global Services at Applied Materials; Paul Lindner, executive technology director at EV Group; and Alissa M. Fitzgerald, founder and managing member at A.M. Fitzgerald & Associates. SE: What’s happening... » read more

Can Intel Dethrone The Foundry Giants?
By Mark LaPedus - 12 Dec, 2013 - Comments: 3

The leading-edge foundry business isn’t for the faint of heart. It requires deep pockets and sound technology to keep pace in the chip-scaling race. And despite pouring billions of dollars into new fabs and processes, foundries are competing for fewer customers at each node. Given the difficult business conditions, only a handful of vendors can afford to compete in the high-end foundry bus... » read more

DSA, Multi-beam Make Steady Progress
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss current and future lithography challenges with Laurent Pain, lithography lab manager at CEA-Leti. What follows are excerpts of that conversation. SE: CEA-Leti has two major programs in lithography. One is in directed self-assembly (DSA) and the other is in multi-beam e-beam. Let’s start with multi-beam. What is Leti doing in multi-beam and what... » read more

Challenges Mount In Inspection And Metrology
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Chipmakers are moving full speed ahead toward smaller process nodes, thereby driving up the costs and complexities in chip manufacturing. The migrations also are putting enormous stress on nearly all points of the fab flow, including a critical but unsung part of the business—process control. Process control involves 20 or so different segments in the inspection and metrology arena. Genera... » read more

Non-Visual Defect Inspection: The Tech of Tomorrow?
By Jeff Chappell - 12 Dec, 2013 - Comments: 0

Remember when it first became obvious that the semiconductor manufacturing industry was going to expect lithography to resolve features smaller than the wavelength of light used in the litho tools themselves? Thanks to techniques such as the use of phase shift photomasks, sub-wavelength lithography is standard in chip fabs today. It might even be viewed as “old hat,” although still an ex... » read more

Defective R&D Funding Models
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

For years, the semiconductor equipment industry has been dealing with an R&D funding gap. Here’s the basic problem: Chipmakers demand certain tools for their next-generation processes, but they are not always willing to foot a large percentage of the R&D bill. And so, the equipment vendors develop the tools and assume a large part of R&D funding--and the risks. Fair or unf... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 06 Dec, 2013 - Comments: 0

A new study reveals that a majority of Americans are making some costly miscalculations regarding the performance of their existing PCs. The survey reveals that Americans lack financial savvy when faced with slow computers. Germany’s Merck KGaA, a pharmaceutical, chemical and life science company, announced an agreement with AZ Electronic Materials, under which Merck KGaA would acquire AZ.... » read more

Blog Review: Dec. 4
By Ed Sperling - 04 Dec, 2013 - Comments: 0

Mentor’s Harry Foster closes his epic study on functional verification with an interesting insight about the real value of industry studies—new questions. It’s hard to argue with that. Cadence’s Brian Fuller takes a shot at the people taking shots at Amazon’s drone delivery service (the term du jour is robots). It does sound cool, as long as they don’t deliver the kind of payloa... » read more

3D NAND Is A Reality – What’s Next?
By Gill Lee - 02 Dec, 2013 - Comments: 0

One of the biggest developments taking place in the semiconductor industry is the emergence of 3D NAND memory technology. Products are available today that feature 3D NAND devices. It has taken years to become a reality — since Toshiba first discussed the concept of 3D NAND at the VLSI Symposium in 2007 – and now it is poised to replace planar NAND flash memory for storage. The path that... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 27 Nov, 2013 - Comments: 0

Gesture sensing is a hot topic. Apple recently confirmed the acquisition of PrimeSense for a reported $360 million. PrimeSense is an Israel-based company known for its structured light technology. “Gesture sensing of 3D depth without a controller is the standard for game consoles such as Microsoft Kinect for Xbox and new PS Camera for PlayStation 4. Clearly, a future Apple TV is the logical p... » read more

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