tag: Applied Materials

Mobile Memory Madness
By Ed Sperling - 15 Nov, 2012 - Comments: 0

By Mark LaPedus The insatiable thirst for more bandwidth in smartphones, tablets and other devices has prompted an industry standards body to revamp its mobile memory interface roadmap. As part of the changes, the Joint Electron Devices Engineering Council (JEDEC) has scaled back the initial version of Wide I/O technology and pushed out the introduction date of a true 3D stacked architectur... » read more

The Return Of RC Delay
By Ed Sperling - 14 Nov, 2012 - Comments: 0

Semiconductor Manufacturing & Design talks with Mehul Naik of Applied Materials about why RC delay has become a hot topic again, and what will be necessary to solve it. [youtube vid=aQjqcpZWi0A] » read more

Quantum Shifts
By Ed Sperling - 25 Oct, 2012 - Comments: 0

By Ed Sperling Intel, STMicroelectronics and some of the leading memory providers already are working on 10nm process technology, and advanced researchers in universities and industry-leading companies are looking at 7nm, 5nm and even beyond. Those who have glimpsed this technological future have similar observations. There is no single technology problem that has to be solved at these node... » read more

Challenges Grow For EUV
By Ed Sperling - 18 Oct, 2012 - Comments: 0

By Mark LaPedus In the late 1990s, a group led by Intel launched a consortium to propel extreme ultraviolet (EUV) lithography into the mainstream. Originally, the consortium, dubbed the EUV LLC, envisioned the advent of EUV scanners that would move into production at the 65nm node. Clearly, the now-defunct consortium underestimated the difficulties and challenges associated with EUV. ASM... » read more

Beam Me Up
By Ed Sperling - 18 Oct, 2012 - Comments: 0

By Mark LaPedus For years, electron-beam tools have been struggling to keep up with photomask complexity, causing an alarming increase in write times and mask production costs. Intel and others recently warned that e-beams soon could reach their fundamental limits, thereby requiring the need for new solutions. And in the multiple patterning era, mask makers could see their capital costs soa... » read more

Mask Repair Enters The Spotlight
By Ed Sperling - 18 Oct, 2012 - Comments: 0

By Mark LaPedus For years, the biggest challenges in photomask manufacturing have revolved around the slow write times for electron-beam tools and soaring mask inspection costs. Now, photomask repair, a sometimes forgotten technology in the mask shop, is in the spotlight and turning into the clash of the titans. Mask repair involves the process of finding defects on a photomask and repairin... » read more

Epitaxy: Seeking Crystalline Perfection
By Applied Materials Writers - 18 Oct, 2012 - Comments: 1

By Richard Lewington Epitaxy is one of the fundamental processes used to make all kinds of semiconductor devices: LEDs, power electronics and, of course, microchips. The term epitaxy means, roughly speaking, “adding order” and that’s exactly what it does. Hot gases react on a surface to “grow” a layer that precisely matches the underlying crystal structure. Epitaxy was first us... » read more

NAND Enters Tough Cycle
By Ed Sperling - 20 Sep, 2012 - Comments: 0

By Mark LaPedus The NAND flash memory market is entering into a new and painful cycle, a period that will impact suppliers, OEMs and fab tool vendors alike. For some time, there has been an oversupply and depressed pricing in the NAND market. In mid-2011, Micron, Samsung, SK Hynix and Toshiba put on the brakes in their capital spending plans. And in recent months, NAND suppliers in total h... » read more

The Rolling Stones Of Chipmaking
By Applied Materials Writers - 20 Sep, 2012 - Comments: 0

By Cheryl Knepfler In 1993, when the Internet was mostly a science experiment, Applied shipped a new P5000 CVD system to the Motorola SPS (now Freescale) Oak Hill fab in Austin, Texas— where it was used to produce processors for Apple computers. A year later, Motorola installed its second P5000 system. Fast forward 20 years and you’ll find both tools on the production line and still runnin... » read more

Universal Memories Fall Back To Earth
By Ed Sperling - 20 Sep, 2012 - Comments: 0

By Mark LaPedus Ten years ago, Intel Corp. declared that flash memory would stop scaling at 65nm, prompting the need for a new replacement technology. Thinking the end was near for flash, a number of companies began to develop various next-generation memory types, such as 3D chips, FeRAM, MRAM, phase-change memory (PCM), and ReRAM. Many of these technologies were originally billed as “uni... » read more

← Older posts Newer posts →

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy