tag: ARM

Experts Panel And Tutorial At DVCon
By Graham Bell - 31 Jan, 2013 - Comments: 0

Besides our usual exhibit at the Design and Verification Conference in Santa Clara at the end of next month, Real Intent has organized a panel and a half-day tutorial that highlights some of the changes happening in our industry—and which may have been overlooked. The panel addresses the interesting topic “Where Does Design End and Verification Begin?” The abstract states that design a... » read more

The CES Effect
By Frank Ferro - 31 Jan, 2013 - Comments: 0

By Frank Ferro CES draws a lot of attention. Everyone wants to be first to see the latest and greatest consumer products. If you don’t mind squeezing through the crowd, you can glimpse the startling picture quality of an OLED TV. Never mind viewing the quality of a 4K Ultra HDTV, at CES you can skip a generation and see what an 85” 8K UHDTV looks like. Talk about resolution! You also can e... » read more

Changes In The Supply Chain
By Ed Sperling - 31 Jan, 2013 - Comments: 0

Runaway complexity in design, implementation, verification and manufacturing is being mirrored across an increasingly complex supply chain. Now the question is what to do about it. Complexity is being driven by the continued shrinking of feature sizes and the clamor for more functionality to leverage the real estate that becomes available with each new process node. But the increased density... » read more

Mixed-Signal Technology Summit Proceedings
By Various Writers - 31 Jan, 2013 - Comments: 0

On September 20 Cadence held the second Mixed-Signal Technology Summit. Experts from Cadence and other leading companies presented the latest mixed-signal design methodologies. If you missed the event, you can still view the material via the below archived proceedings. To view the presentations and videos, click here. » read more

What Will Replace Dual Damascene?
By Mark LaPedus - 24 Jan, 2013 - Comments: 0

By Mark LaPedus In the mid-1990s, IBM announced the world’s first devices using a copper dual damascene process. At the time, the dual damascene manufacturing process was hailed as a major breakthrough. The new copper process enabled IC makers to scale the tiny interconnects in a device, as the previous material, aluminum, faced some major limitations. Dual damascene remains the workhorse... » read more

Lessons From Past Architecture Wars
By Marc David Levenson - 24 Jan, 2013 - Comments: 0

By Marc David Levenson There was an interesting IEEE panel discussion in Silicon Valley recently, reviewing the microprocessor architecture wars of the ’70s, ’80s and ’90s. How did the Intel x86 architecture become so dominant when there were other capable designs, including more efficient RISC (Reduced Instruction Set Computing) chips? How did the x86s overcome competition from Zilog, M... » read more

ST-Ericsson 28nm FD-SOI/ARM Chip Hits 2.8GHz at CES
By Various Writers - 22 Jan, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ What a great start to 2013: at CES in Las Vegas, ST-Ericsson announced the NovaThor™ L8580 ModAp, “the world’s fastest and lowest-power integrated LTE smartphone platform.” This is the one that’s on STMicroelectronics’ 28nm FD-SOI, with sampling set for Q1 2013. And it’s a game changer – for users, fo... » read more

Tradeoffs On The Fly
By Ed Sperling - 17 Jan, 2013 - Comments: 0

By Ann Steffora Mutschler With classical bulk planar technology no longer shrinkable, the industry has been honing in on new ways to continue some scaling, achieve extra speed or better power while minimizing leakage. “To overcome the limits [of bulk planar technology] we need a different solution,” explained Giorgio Cesano, technology R&D marketing director at STMicroelectron... » read more

Embedded Power Management Challenges Grow
By Ed Sperling - 17 Jan, 2013 - Comments: 0

By Ann Steffora Mutschler Power management always has been, and will continue to be, a big issue with electronic devices. But when it comes to power management in embedded systems—controlling battery power in a smartphone, an industrial automation or automotive application, among a myriad of other options—the approaches come with different variables. For example, deeply embedded s... » read more

First Silicon At 14nm
By Ed Sperling - 17 Jan, 2013 - Comments: 0

By Ed Sperling The first 14nm test chips are beginning to roll out the door from foundries, and companies are beginning to trumpet their success. But before anyone pops the champagne corks, there are some caveats. First of all, what most people are billing as 14nm chips are actually mostly 20nm. They are readily willing to concede that point, settling on 16nm, but the reality is that it’s... » read more

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