tag: ARM

Arm’s Input Qualification Methodology Using PowerPro
By Siemens EDA - 27 Apr, 2022 - Comments: 0

This white paper proposes a new automated input qualification methodology that Arm developed using Siemens EDA’s PowerPro software portfolio that performs various data integrity checks at the IC design build and prototype stage. This methodology ensures in quicker iterations that input data are high fidelity, leading to a well correlated power numbers. Should multiple iterations be necessary,... » read more

Blog Review: April 27
By Jesse Allen - 27 Apr, 2022 - Comments: 0

Siemens' Joseph Dailey and Jake Wiltgen dispel misunderstandings around safety qualification of software tools and point to some of the safety issues that could lead to schedule delays and additional costs. Synopsys' Mark Kahan explains the testing that went into creating parts of the James Webb Space Telescope and key questions that were asked to ensure the mission could be successful even ... » read more

Paving The Way To Chiplets
By Mark LaPedus - 25 Apr, 2022 - Comments: 2

The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet standards, and a cost analysis tool for determining the feasibility of a given chiplet-based design, are two new and important pieces. Along with other efforts, the goal is to propel the chiplet m... » read more

More Options, Less Dark Silicon
By Ed Sperling - 20 Apr, 2022 - Comments: 0

Chipmakers are beginning to re-examine how much dark silicon should be used in a heterogenous system, where it works best, and what alternatives are available — a direct result of a slowdown in Moore's Law scaling and the increasing disaggregation of SoCs. The concept of dark silicon has been around for a couple decades, but it really began taking off with the introduction of the Internet ... » read more

Blog Review: April 20
By Jesse Allen - 20 Apr, 2022 - Comments: 0

Cadence's Paul McLellan looks at the difference between 3D packaging and 3D integration and the different approaches to system-in-package designs. Siemens' Spencer Acain finds that despite having less precision and flexibility than digital chips, analog computing is having a resurgence in the space of cutting-edge AI thanks to the speed and energy efficiency in specialized tasks. Synopsys... » read more

Energy Harvesting Starting To Gain Traction
By John Koon - 18 Apr, 2022 - Comments: 4

Tens of billions of IoT devices are powered by batteries today. Depending on the compute intensity and the battery chemistry, these devices can run steadily for short periods of time, or they can run occasionally for decades. But in some cases, they also can either harvest energy themselves, or tap into externally harvested energy, allowing them to work almost indefinitely. Energy harvesting... » read more

The Set Top Box Is Getting A Retrofit
By Pablo Fraile - 14 Apr, 2022 - Comments: 0

Will processors jumpstart 8K? System-on-chip (SoC) designers and home device makers are experimenting with AI techniques to upscale high-definition or even standard-definition programs in a way that looks natural and realistic. Here’s how it works. Rather than stretching an image over a wider battery of pixels (causing pixelation) or filling in the new pixels by extrapolating informatio... » read more

Architecting Faster Computers
By Brian Bailey - 14 Apr, 2022 - Comments: 3

To create faster computers, the industry must take a major step back and re-examine choices that were made half a century ago. One of the most likely approaches involves dropping demands for determinism, and this is being attempted in several different forms. Since the establishment of the von Neumann architecture for computers, small, incremental improvements have been made to architectures... » read more

Blog Review: April 13
By Jesse Allen - 13 Apr, 2022 - Comments: 0

Synopsys' Scott Durrant, Priyank Shukla, Mitch Heins, and Jigesh Patel provide a brief overview of the history of copper and optical interconnects used in data centers, the limitations of existing interconnect solutions, and the future of co-packaged optics. Siemens' Trey Reeser finds that it's not only necessary for semiconductor companies to address the safety and security of products for ... » read more

Silicon Lifecycle Management’s Growing Impact On IC Reliability
By Ed Sperling - 12 Apr, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management, how it's expanding and changing, and where the problems are, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer science at Stanford University; a... » read more

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