Chip Industry Week In Review


Manufacturing ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. SpaceX filed documents for a “Terafab” semiconductor manufacturing and computing facility at Gibbons Creek Reservoir in Texas, with a... » read more

Chip Industry Technical Paper Roundup: Apr. 14


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Device/circuit simulations of silicon spin qubits based on a gate-all-around transistor 🔗 Teikyo University, RIKEN Causal AI For AMS Circuit Design: Interpretable Parameter Effects Analysis 🔗 University of Florida Reliability of Wide B... » read more

Chip Industry Week In Review


Deals, Funding Intel will join Elon Musk’s Terafab chip manufacturing project alongside Tesla, SpaceX, and xAI. Intel described its role as helping refactor silicon fab technology for a project targeting production of 1 TW/year of compute for AI and robotics applications. Intel and Google are expanding a multi-year collaboration on AI and cloud infrastructure, with Intel Xeon processo... » read more

Status of WBG Device Reliability in Automotive (U. Bremen et al.)


A new technical paper, "Reliability of Wide Bandgap Semiconductors for Automotive Applications," was published by the Universitat Bremen, Technische Universitat Chemnitz, BMW, Robert Bosch GmbH, Infineon, Semikron Danfoss, and FH Dortmund. Abstract "Wide bandgap (WBG) semiconductor devices offer tremendous advantages over their silicon counterparts. Automotive applications benefit particu... » read more

Automotive Week In Review


Quick links: Deals and New Chips, Batteries and BEVs, Autonomous, Policy and Research. Deals and New Chips Infineon and BMW are jointly developing software-defined vehicles based on BMW’s “Neue Klasse” architecture and Infineon’s MCUs, high-speed Ethernet solutions, power management ICs, and power switches. Tata Electronics will manufacture Qualcomm's automotive modules in I... » read more

Automotive Week In Review


Quick links: Automotive chips, Autonomous, EVs, Batteries, Policy, Research. Automotive chips  Mythic and Honda will jointly develop an automotive-grade AI SoC for Honda’s SDVs that leverages Mythic’s energy-efficient analog compute-in-memory technology. ST released a new MCU with AI acceleration for the automotive edge, integrating an embedded neural network accelerator. I... » read more

Chip Industry Week in Review


Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S.  The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

Rethinking Automotive Development: Virtualization for the Software-Defined Era


Stay competitive in the new era of software-defined vehicles. This guide reveals how virtualization enables automotive leaders to: Accelerate development and innovation Unlock cost savings and reduce delays Overcome legacy challenges and adapt to CASE (Connected, Autonomous, Shared, Electric) trends Streamline R&D and integration processes Who should read this guide? ... » read more

Chip Industry Week in Review


Amkor, TSMC, and Cadence partnered with Tesoro VC, which will serve as the lead operator of a new Global AI + Semiconductor Startup Hub and a Global Design Center in Phoenix, Arizona, aimed at chip innovation, startup growth, and advanced manufacturing. Nvidia will invest $5 billion in Intel common stock at a purchase price of $23.28 per share and the companies will collaborate on AI infrastru... » read more

Chip Industry Week In Review


ASML and imec signed a five-year strategic partnership to advance semiconductor innovation and sustainable technology. The collaboration will leverage ASML’s full product portfolio, including high-NA EUV, DUV immersion, and advanced metrology tools, within imec’s pilot line for sub-2nm R&D. Supported by EU and national funding, it will also drive research in silicon photonics, memory, a... » read more

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