Chip Industry Technical Paper Roundup: Apr. 14

Silicon spin qubits based on GAA; causal AI for AMS design; wide-bandgap automotive reliability; agentic HLS; co-packaged optics; constraint programming for semiconductor manufacturing; automated security assertions with LLMs.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Device/circuit simulations of silicon spin qubits based on a gate-all-around transistor 🔗 Teikyo University, RIKEN
Causal AI For AMS Circuit Design: Interpretable Parameter Effects Analysis 🔗 University of Florida
Reliability of Wide Bandgap Semiconductors for Automotive Applications 🔗 Universitat Bremen, TU Chemnitz, BMW, Robert Bosch, Infineon et al.
Agent Factories for High Level Synthesis: How Far Can General-Purpose Coding Agents Go in Hardware Optimization? 🔗 IBM
3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment 🔗 University of Wisconsin, MIT et al.
Quantifying the Global Impact of Constraint Programming Based Local Scheduling in Semiconductor Manufacturing 🔗 Infineon, University of Klagenfurt
Assertain: Automated Security Assertion Generation Using LLMs 🔗 University of Florida

Find more semiconductor research papers here.



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