Chip Industry Technical Paper Roundup: Jan. 27


New technical papers recently added to Semiconductor Engineering’s library: [table id=517 /] Find more semiconductor research papers here. » read more

Overview and Comparison of Devices Used For Optical Waveguide-to-Waveguide Coupling (MIT et al.)


A new technical paper titled "Advances in waveguide to waveguide couplers for 3D integrated photonic packaging" was published by researchers at MIT and Bridgewater State University. Abstract "In this paper, we provide an overview and comparison of devices used for optical waveguide-to-waveguide coupling including inter-chip edge couplers, grating couplers, free form couplers, evanescent cou... » read more

Research Bits: August 19


Co-packaged optics Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to co-package photonic and electronic chips that uses existing automated pick-and-place assembly equipment in traditional fabs along with a less-expensive passive alignment process. “We’ve developed a packaging design [for integrating photonics with el... » read more