Chip Industry Technical Paper Roundup: Jan. 27

Reliable AI accelerators; better contact resistance; side-channel attack using memory reorderings; scaling 2D nanoribbons; waveguide to waveguide couplers for 3D photonics packaging; photonics gate array; SLM edge inference; NoC architectures; trojan detection.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Improving Contact Resistance in Top-Gate Carbon Nanotube Transistor through Self-Aligned MoOx Nanoparticle Contact Doping National Yang Ming Chiao Tung University and National Center for Instrumentation Research
Memory DisOrder: Memory Re-orderings as a Timerless Side-channel University of Washington, Duke, UCSC, Raytheon and Microsoft
Scaling of 2D Semiconductor Nanoribbons for High-Performance Electronics Purdue, National University of Singapore, Nexstrom, and Dankook University
Advances in waveguide to waveguide couplers for 3D integrated photonic packaging MIT and Bridgewater State University
The Quest for Reliable AI Accelerators: Cross-Layer Evaluation and Design Optimization Peking University and Beijing Advanced Innovation Center for ICs
High-Speed Non-Volatile Barium Titanate Field Programmable Photonic Gate Array Universitat Politècnica de València, iPronics Programmable Photonic, Lumiphase, Univ. of West Attica and CEA-Leti
QMC: Efficient SLM Edge Inference via Outlier-Aware Quantization and Emergent Memories Co-Design UCSD and San Diego State
Secure Multi-Path Routing with All-or-Nothing Transform for Network-on-Chip Architectures University of Florida
COVERT: Trojan Detection in COTS Hardware via Statistical Activation of Microarchitectural Events University of Kansas and University of Florida

Find more semiconductor research papers here.



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