Automotive Outlook: 2026


The automotive industry stands at a crossroads entering 2026, facing a complex interplay of global tariffs, evolving electric vehicle (EV) dynamics, and the infusion of AI into just about everything. As manufacturers and suppliers navigate recent financing shifts and regulatory changes, they also must address consumer concerns over EV affordability and range, OEM concerns over when to develo... » read more

Security Threats Converge On IoT, Industrial ICs, Physical AI


Devices in a broad range of edge AI applications are increasingly at risk of hacking or tampering, with the stakes varying greatly depending on how much the device can impact and interact with human life. Design methods and protection techniques must now be included up front in the design cycle for optimal protection of consumers and companies as the quantum threat looms. In today’s factor... » read more

3D-IC Success Stories: Faster Bandwidth, Lower Power, On-Time Tapeouts


As scaling at advanced nodes becomes increasingly constrained by cost, yield, and power density, semiconductor innovation is shifting decisively toward 3D-IC technologies, chiplets, and heterogeneous integration. Across AI infrastructure, cloud computing, automotive electronics, and high-performance systems, design teams are moving beyond monolithic SoCs to unlock new levels of performance, e... » read more

Blog Review: Jan. 7


Cadence's Reela Samuel presents an overview of through-silicon vias, including structure, pitch, and electrical behavior, key layout rules such as keep-out zones and stress constraints, and how TSV parasitics influence bandwidth, latency, and system-level performance. Siemens' Andras Vass-Varnai identifies five thermal trends to watch and how they’ll reshape design and packaging workflows ... » read more

Annual Global IC Fabs And Facilities Report


Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Chip Industry’s Top Videos 2025


Rising complexity, new architectures, and AI's permeation of nearly everything left engineers struggling to keep up in 2025, as evidenced by this year's viewership numbers. Among the hottest topics were verification, agentic AI, DRAM/HBM, optimization of data movement, chiplets, and heterogeneous integration, but there was steady traffic growth across all sectors. Top 10 most-watched videos ... » read more

Chip Industry Week In Review


Deals: NVIDIA inked a $20B non-exclusive licensing deal with Groq for its inference technology. The startup's founder, Jonathan Ross, and some other employees will join NVIDIA to assist in scaling and advancing the technology. The non-exclusive licensing deal, versus an outright purchase, is a tool other companies have used to avoid antitrust regulation. Samsung Ventures made a strategic inv... » read more

Blog Review: Dec. 24


Cadence's Jakob Engblom shares highlights from the recent SDV Europe conference, including why software-defined vehicles will require much closer, faster collaboration between suppliers and customers, with virtualization for software development and testing taking on a key role, as well as API questions and tire sensors. Synopsys' Tom De Schutter and Marc Serughetti predict that new cars wil... » read more

PCIe Design Guide – Q&A (Gen 4, 5, 6) – Part 2


As PCI Express (PCIe) evolves through Gen4, Gen5, and now Gen6, the complexity of high-speed design continues to grow. Signal and power integrity, equalization, clocking, and compliance — every layer of the PCB must be optimized for speed and reliability. The PCIe Design Guide – Q&A (Part 2) expands on the first volume with a deep dive into simulation, validation, and compliance, a... » read more

3D-IC Market Outlook: Technology Roadmaps, Readiness, And Design Implications


The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore's Law scaling. As performance, power efficiency, and system complexity outpace what planar integration can deliver economically, vertical integration and heterogeneous system design are no longer experimental; they are becoming foundational. Advanced packagin... » read more

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