Week In Review: Design, Low Power


Cadence will acquire NUMECA International, a provider of computational fluid dynamics (CFD), mesh generation, multi-physics simulation, and optimization solutions for industries including aerospace, automotive, industrial, and marine. “Next-generation products and systems require comprehensive multi-physics engineering solutions encompassing IP, semiconductors, IC packaging, modules, board... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive/Mobility Former U.S. president Donald Trump pardoned the former Google engineer who plead guilty to taking Google’s self-driving car trade secrets before becoming the head of Uber Technologies’ self-driving car unit. Anthony Levandowski was sentenced 18 months in prison in August after pleading guilty in March to one count of a 33-charge indictment, according to a story in Reute... » read more

Blog Review: Jan. 20


Siemens EDA's Harry Foster takes a look at the amount of time IC and ASIC projects spend in verification, changes in the number of engineers on a project, and how engineers are spending their time. Synopsys' Stelios Diamantidis considers the importance of specialized accelerators for AI workloads as both cloud and edge push the PPA limits of current technologies. Cadence's Paul McLellan p... » read more

Hidden Costs In Faster, Low-Power AI Systems


Chipmakers are building orders of magnitude better performance and energy efficiency into smart devices, but to achieve those goals they also are making tradeoffs that will have far-reaching, long-lasting, and in some cases unknown impacts. Much of this activity is a direct result of pushing intelligence out to the edge, where it is needed to process, sort, and manage massive increases in da... » read more

Von Neumann Is Struggling


In an era dominated by machine learning, the von Neumann architecture is struggling to stay relevant. The world has changed from being control-centric to one that is data-centric, pushing processor architectures to evolve. Venture money is flooding into domain-specific architectures (DSA), but traditional processors also are evolving. For many markets, they continue to provide an effective s... » read more

Die-To-Die Stress Becomes A Major Issue


Stress is becoming more critical to identify and plan for at advanced nodes and in advanced packages, where a simple mismatch can impact performance, power, and the reliability of a device throughout its projected lifetime. In the past, the chip, package, and board in a system generally were designed separately and connected through interfaces from the die to the package, and from the packag... » read more

Verification’s Inflection Point


Functional verification is nearing an inflection point, brought on by rising complexity and the many tentacles that are intermixing it with other disciplines. New abstractions or different ways to approach the problems are needed. Being a verification engineer is no longer enough, except for those whose concerns is block-level verification. Most of the time and effort spent in verification i... » read more

Imec’s Plan For Continued Scaling


At IEDM in December, the opening keynote (technically "Plenary 1") was by Sri Samevadam of Imec. His presentation was titled "Towards Atomic Channels and Deconstructed Chips." He presented Imec's view of the future of semiconductors going forward, both Moore's Law (scaling) and More than Moore (advanced packaging and multiple die). It is always interesting to hear Imec's view of the world sinc... » read more

Hard-To-Hire Engineering Jobs


While the pandemic has hurt many job sectors, the semiconductor industry can't get enough qualified people. And that shortage is expected to persist for years, as companies reach deep into untapped talent pools around the globe. Most in demand are experienced engineers and engineers with hybrid knowledge. Skills in machine learning and artificial intelligence are very desirable. Combined kno... » read more

Blog Review: Jan. 13


Siemens EDA's Harry Foster tracks trends in IC and ASIC design and finds that increased design size is only one dimension of the growing complexity challenge. Synopsys' Chris Clark and Dennis Kengo Oka predicts how the automotive industry will change in 2021, including new standards for security, increased use of AI and V2X technologies, and a growing focus on software. Cadence's Paul McL... » read more

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