tag: Cadence

Edge-Inference Architectures Proliferate
By Bryon Moyer - 04 Feb, 2021 - Comments: 0

First part of two parts. The second part will dive into basic architectural characteristics. The last year has seen a vast array of announcements of new machine-learning (ML) architectures for edge inference. Unburdened by the need to support training, but tasked with low latency, the devices exhibit extremely varied approaches to ML inference. “Architecture is changing both in the comp... » read more

Blog Review: Feb. 3
By Jesse Allen - 03 Feb, 2021 - Comments: 0

Cadence's Paul McLellan listens in on the outlook from SEMI's recent Industry Strategy Symposium, which looked at the prospects for global recovery, the application areas where growth is expected, and how segments have recently performed. Siemens EDA's Harry Foster takes a look at trends in the adoption of languages and libraries for IC and ASIC designs and finds continued interest in System... » read more

Hot Or Not? An Introduction To Electrical Thermal Co-Design
By Cadence - 03 Feb, 2021 - Comments: 0

Heat transfer is not a one-way street. Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related ... » read more

Designing Low Energy Chips And Systems
By Ann Mutschler - 01 Feb, 2021 - Comments: 1

Energy optimization is beginning to shift left as design teams begin examining new ways to boost the performance of devices without impacting battery life or ratcheting up electricity costs. Unlike power optimization, where a skilled engineering team may reduce power by 1% to 5%, energy efficiency may be able to cut effective power in half. But those gains require a significant rethinking of... » read more

Roaring ’20s For The Chip Industry
By Brian Bailey - 28 Jan, 2021 - Comments: 0

2020 was a good year for the semiconductor industry and the EDA industry that fuels it, but 2021 has the opportunity to be even better. New end application markets continue to open, and what were once seen as technical hurdles are leading to a multitude of innovative solutions, all of which need suitable tooling. No company can afford to invest everywhere, and so for EDA companies, their rel... » read more

Big Changes In Verification
By Ann Mutschler - 28 Jan, 2021 - Comments: 0

Verification is undergoing fundamental change as chips become increasingly complex, heterogeneous, and integrated into larger systems. Tools, methodologies, and the mindset of verification engineers themselves are all shifting to adapt to these new designs, although with so many moving pieces this isn't always so easy to comprehend. Ferreting out bugs in a design now requires a multi-faceted... » read more

Hyperscaling The 21st Century Engineer
By Frank Schirrmeister - 28 Jan, 2021 - Comments: 0

While January is the month of predictions for many, I have made it a habit to look back and see how previous forward-looking assessments have worked out. It is fascinating to see how many past predictions were off and how little has changed in some areas. Twenty years ago, in January 2001, the front cover of IEEE Spectrum set the theme of ubiquitous connectivity in an always-on world. Some o... » read more

Taming Non-Predictable Systems
By Brian Bailey - 28 Jan, 2021 - Comments: 0

How predictable are semiconductor systems? The industry aims to create predictable systems and yet when a carrot is dangled, offering the possibility of faster, cheaper, or some other gain, decision makers invariably decide that some degree of uncertainty is warranted. Understanding uncertainty is at least the first step to making informed decisions, but new tooling is required to assess the im... » read more

Blog Review: Jan. 27
By Jesse Allen - 27 Jan, 2021 - Comments: 0

Synopsys' Godwin Maben finds that applications like high-performance computing and AI are bringing new dynamics to the power equation, and the key power considerations for chip design that will likely emerge over the course of the year. Siemens EDA's Harry Foster checks out trends in verification technology adoption for IC and ASIC design, with increasing numbers of designs using both dynami... » read more

5G NR Design eMBB
By Cadence - 27 Jan, 2021 - Comments: 0

Next-generation 5G/6G communication systems will provide massive connectivity to the internet with extreme capacity, coverage, reliability, and ultra-low latency, enabling a wide range of new services made possible through innovative technologies. Enhanced mobile broadband (eMBB) extends the current mobile experience with high data throughput on the order of more than 10Gbps, high system capaci... » read more

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