Using Processor Trace At The System Level


The race to process more data faster using less power is creating a series of debug challenges at the system level, where developers need to be able to trace interactions across multiple and often heterogeneous processing elements that may function independently of each other. In general, trace is a hardware debug feature that allows the run-time behavior of IP to be monitored. More specific... » read more

Blog Review: April 22


Mentor's Shivani Joshi takes a look at the benefits of adding ground planes in PCB design to improve signal integrity and reduce electrical noise and interference. Cadence's Paul McLellan points to the gradual adoption of 3D packaged systems, the role of mobile in driving adoption, and the rise of chiplets. Synopsys' Taylor Armerding shares some tips for productive remote teamwork from th... » read more

Power Becomes Bigger Concern For Embedded Processors


Power is emerging as the dominant concern for embedded processors even in applications where performance is billed as the top design criteria. This is happening regardless of the end application or the process node. In some high-performance applications, power density and thermal dissipation can limit how fast a processor can run. This is compounded by concerns about cyber and physical secur... » read more

Blog Review: April 15


Mentor's Neil Johnson argues that it's time to reevaluate the current definition of verification methodology, with a new focus on methodologies driven by the needs of the design and best suited to different abstractions. Synopsys' Derek Handova warns that the need to manage the security risks of billions of IoT devices will continue to change the requirements and scope of 5G security. Cad... » read more

3 Ways To Improve Design Collaboration


In my experience, design engineers are zealous folks who want to extract every ounce of performance out of their design. They continue to make incremental changes to the design until the very end, as close to tape out as possible. Each change made to the design requires corresponding changes to be implemented in the layout. If you are a design engineer, how do you answer this question from y... » read more

Designing Ultra Low Power AI Processors


AI chip design is beginning to shift direction as more computing moves to the edge, adding a level of sophistication and functionality that typically was relegated to the cloud, but in a power envelope compatible with a battery. These changes leverage many existing tools, techniques and best practices for chip design. But they also are beginning to incorporate a variety of new approaches tha... » read more

Easier Bond Finger Solder Mask Openings


If you design wire bond packages, you’re familiar with the need for the bond fingers and rings on the package substrate layers to be exposed through the solder mask layer. If they aren’t, it becomes… rather difficult… to bond the wire to them, after all! We talked about general-purpose bounding shapes a few weeks ago in “A Boundless Bounty of Bounding Shapes”. Bond fingers have a... » read more

Power-Hungry Safety And Security


There is a price to pay for everything. When it comes to adding safety and security into a device, the costs in terms of power and area can be significant, but if the task is taken seriously, those costs can be managed and minimized. New analysis and implementation tools are coming to market that can also help to keep the costs contained. But it also requires the right mindset. As more indus... » read more

Blog Review: April 8


Synopsys' Taylor Armerding shares some tips for getting development, security, and operations teams communicating effectively and working toward a single purpose. Cadence's Paul McLellan looks back over computing history to how the best way to deliver computing resources has shifted from cloud to edge and back again. Mentor's Shivani Joshi shares an overview of flexible PCB designs and wh... » read more

Tracking Automotive’s Rapidly Shifting Ecosystem


The automotive ecosystem is becoming much harder to navigate as automakers, Tier 1s and IP vendors redefine their relationships based upon shifting value caused by an rapidly expanding amount of increasingly interdependent and complex electronic content. Predictions of massive change started almost a decade ago with a number of pilot programs around autonomous vehicles. But those shifts real... » read more

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