tag: Cadence

The Week In Review: Design/IoT
By Jesse Allen - 15 Apr, 2016 - Comments: 0

Mergers & Acquisitions Cadence acquired [getentity id="22444" comment="Rocketick"], an Israel-based company focused on multicore parallel simulation. Founded in 2008, their original rise and claim to fame was acceleration on GPUs, having received significant funding from Nvidia. The deal is expected to close in the second quarter of fiscal 2016, and terms were not disclosed. Tools &am... » read more

Power Management Heats Up
By Brian Bailey - 14 Apr, 2016 - Comments: 0

Power management has been talked about a lot recently, especially when it comes to mobile devices. But power is only a part of the issue—and perhaps not even the most important part. Heat is the ultimate limiter. If you cannot comfortably place the device on your face or wrist, then you will not have a successful product. Controlling heat, at the micro and macro levels, is an important asp... » read more

2.5D Becomes A Reality
By Ed Sperling - 14 Apr, 2016 - Comments: 2

Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

Analyzing The Integrity Of Power
By Ann Mutschler - 14 Apr, 2016 - Comments: 0

Power analysis is shifting much earlier in the chip design process, with power emerging as the top design constraint at advanced process nodes. As engineering teams pack more functionality and content into bigger and more complex chips, they are having to deal with more complex interactions that affect everything from power to its impact on signal integrity and long-term reliability. That, i... » read more

Bridging The IP Divide
By Brian Bailey - 14 Apr, 2016 - Comments: 0

The adoption of an IP-based model has enabled designs to keep filling the available chip area while allowing design time to shrink. But there is a divide between IP providers and IP users. It is an implicit fuzzy contract about how the IP should be used, what capabilities it provides, and the extent of the verification that has been performed. IP vendors have been trying to formalize this as mu... » read more

Blog Review: April 13
By Jesse Allen - 13 Apr, 2016 - Comments: 0

A Lam Research staff writer discusses the transformational effects of NAND flash memory and looks at the challenges of the next step: building 3D NAND structures. With the recent reports of people lining up to preorder the Model 3, Tesla may seem like the hottest electric vehicle company right now. But Mentor's Andrew Macleod argues it may actually be BYD Auto, a Chinese company that that so... » read more

Unexpected Security Holes
By Ed Sperling - 13 Apr, 2016 - Comments: 0

Security is emerging as one of the top challenges in semiconductor design across a variety of markets, with the number of security holes growing by orders of magnitude in sectors that have never dealt with these kinds of design constraints before. While security has been a topic of conversation for years in mobile phones and data centers, commercial and industrial equipment is being connecte... » read more

The Week In Review: Design/IoT
By Jesse Allen - 08 Apr, 2016 - Comments: 0

Tools Cadence unveiled the latest updates to its Virtuoso platform, adding enhanced data handling for up to 20X improvement in loading waveform databases in excess of 1GB and a 50X improvement in versioning and loading set-up files into the environment in the Analog Design Environment. Updates to the Layout Suite offer up to 100X accelerated zoom, pan, drag and draw performance on large layo... » read more

The Race To Secure The Car
By Ann Mutschler - 07 Apr, 2016 - Comments: 0

A shift is underway in the automotive industry to connect cars to each other and to a variety of communications infrastructure, adding many of the features that consumers now expect in mobile devices as well as some new ones that ultimately will lead to autonomous vehicles. But along with those changes are some nagging questions about just how safe that technology will be for consumers and othe... » read more

Blog Review: April 6
By Jesse Allen - 06 Apr, 2016 - Comments: 0

A wall of underground ice is being built to contain contaminated water runoff from the Fukushima nuclear power plant and Swedish researchers want to make windowpanes out of wood, in this week's top tech picks from Ansys' Justin Nescott. Plus, if you're concerned about being spied on by aliens, there's a way the earth could hide. Mentor's Andrew Macleod digs into the problems of centralizing ... » read more

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