Chiplet Standards Aim For Plug-n-Play


Key Takeaways Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in progress. Existing work covers packaging, a system architecture, various design kits, a universal link layer, and updates to BoW. Today’s chiplets exist in silos. In a ... » read more

3DKs: Making Headway On Chiplet Standards


The chiplet model has been proven by the early adopters. Large companies that successfully developed chips at leading nodes have integrated multiple chiplets into systems, where the entire silicon cycle is performed in-house. But the industry’s long-term goal of a free and open chiplet marketplace, in which companies of any size can reap the rewards and economies of scale associated with mult... » read more

Top-Down Vs. Bottom-Up Chiplet Design


Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation. The case for chiplets is well understood. They can speed up time to market with consistent results, at whatever process node work... » read more