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Shortages, Challenges Engulf Packaging Supply Chain


A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more

Moving Data And Computing Closer Together


The speed of processors has increased to the point where they often are no longer the performance bottleneck for many systems. It's now about data access. Moving data around costs both time and power, and developers are looking for ways to reduce the distances that data has to move. That means bringing data and memory nearer to each other. “Hard drives didn't have enough data flow to cr... » read more

Inspecting IC Packages Using Die Sorters


The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools in the in-line production flow, but it also now requires new die sorting equipment with advanced inspection capabilities. Die sorters are not the kind of equipment that typically attracts attenti... » read more