OneSpin Users Gather in Munich


Even more than most other high-tech companies, EDA vendors rely on their users for many aspects of their success. Of course, customers provide the revenue that fuels the business, but their influence goes far beyond that. Many features in EDA tools, and even entire categories of products, arise from working closely with advanced users. Even before traditional Beta-testing, selected users provid... » read more

Better, Not Best


The semiconductor industry has been lulled into a particular way of thinking by Moore's Law. It is like the age-old joke — you don't have to outrun a bear, you only have to be faster than your companion. The same has held true for designs. There is little to no point being the best, you only have to be good enough to be better than the competition. That sets the bar. Best is also relative.... » read more

Thoroughly Verifying Complex SoCs


The number of things that can go wrong in complex SoCs targeted at leading-edge applications is staggering, and there is no indication that verifying these chips will function as expected is going to get any easier. Heterogeneous designs developed for leading-edge applications, such as 5G, IoT, automotive and AI, are now complex systems in their own right. But they also need to work in conju... » read more

Portable Stimulus And Digital Twins


It has been a year since Accellera's Portable Test and Stimulus Specification became a standard. Semiconductor Engineering sat down to discuss the impact it has had, and the future direction of it, with  Larry Melling, product management director for Cadence; Tom Fitzpatrick, strategic verification architect for Mentor, a Siemens Business; Tom Anderson, technical marketing consultant for OneSp... » read more

Is There A Crossover Point For Mainstream Anymore?


Until 28nm, it was generally assumed that process nodes would go mainstream one or two generations after they were introduced. So by the time the leading edge chips for smartphones and servers were being developed at 16/14nm and 10/7nm, it was assumed that developing a chip at 28nm would be less expensive, less complex, and that the process rule deck would shrink. That worked for decades. Th... » read more

Addressing Pain Points In Chip Design


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx, Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Leveraging Data In Chipmaking


John Kibarian, president and CEO of PDF Solutions, sat down with Semiconductor Engineering to talk about the impact of data analytics on everything from yield and reliability to the inner structure of organizations, how the cloud and edge will work together, and where the big threats are in the future. SE: When did you recognize that data would be so critical to hardware design and manufact... » read more

Service Revenue Growing With Chip Complexity


Rising complexity, new markets, and a shortage of in-house expertise are beginning to rekindle demand for services for the first time in nearly a decade. The semiconductor industry has been racing to design chips for a variety of new and existing applications, but they are facing challenges on a number of fronts: Leading-edge chips require new architectures due to a sharp reduction in s... » read more

Mary Jane Irwin Receives The Kaufman Award


Mary Jane Irwin just got back from a cruise around the Greek islands with her husband of 53 years to celebrate being the first woman to receive the Kaufman award. When I wrote my post The 2019 Kaufman Award Goes to Mary Jane Irwin about her receiving the awards last week, I mostly just used the boilerplate biographical information from the press release. But that's rather dry, so I called her u... » read more

Less Margin, More Respins, And New Markets


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

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