Layers Of Business And Tech Issues


Slice an onion in half and one onion pretty much looks like any other onion. Peel it back, layer by layer, and put it under a powerful microscope, and each layer suddenly looks very different. The same is true for semiconductors. To the outside world, a chip is a chip and an interconnect is an interconnect. Each one has different specs, but even the parts that make up those chips look remar... » read more

Changes And Challenges


At 130nm, the shift to copper interconnects and 300mm wafer sizes was considered to be the most difficult transition in its long and incredibly efficient history. The next chapter will be even tougher. It’s not that change is a foreign concept to semiconductor design and manufacturing. In fact, it’s probably the only constant over the past 50 years. But in the past, those changes tended ... » read more

RTL Signoff


Piyush Sancheti, Atrenta's vice president of product marketing, talks with Low-Power/High-Performance Engineering about where the pain points are in design and why RTL signoff has become so important. [youtube vid=8Ra1_VmzW50] » read more

DAC Is Where?


By Mike Gianfagna DAC season is upon us. I gave up counting the number of DACs I’ve attended a long time ago—when I turned 29 for the third time, I believe. This year, DAC is special in a few important ways. First of all, it’s the 50th DAC. Yes, the show has indeed been around that long. It started as a workshop with a bunch of engineers debating algorithms. For an industry that is arg... » read more

Taking Aim At Big Data


By Ed Sperling As the Internet of Things bridges the gap between the mobile and big data worlds, EDA and IP vendors increasingly are looking well beyond their usual boundaries. How successful they are at moving upward into a market that is far less price-sensitive remains to be seen. But from a technology standpoint, at least, the issues encountered by data centers and cloud providers are ... » read more

Design-For-DSA Industry Begins To Assemble


By Mark LaPedus The industry is aggressively pursuing directed self-assembly (DSA) as an alternative patterning technology for future chip designs. DSA, which enables fine pitches through the use of block copolymers, is in the R&D pilot line stage today. The fab tools, process flows and materials are basically ready, but there are still several challenges to bring the technology from th... » read more

Supply Chain Catch-Up


There always will be a few big companies marching to the latest process node available to them. The problem these days isn’t their commitment to pushing forward. It’s the baggage train following them. It’s getting longer, more diverse, and in some cases, it’s falling out of sync. The foundries are out in front with 14nm finFETs, and they’re already working on 10nm transistors—pos... » read more

Executive Briefing: Lip-Bu Tan


By Ed Sperling LPHP: From a high level, what are your customers doing differently these days? Tan: What system companies are looking for is time-to-market and differentiation. They want to differentiate on specific functions. IT has become very important in this process. And in terms of tools, they are looking for end-to-end solutions. Besides the advanced nodes and IP blocks, they are starti... » read more

Observation Post


By Pranav Ashar After attending the 2013 Design and Verification Conference (DVCon) in San Jose, Calif., I have compiled notes as both an observer and a panel participant. Here are my observations: Wally Rhines, CEO of Mentor Graphics, gave the keynote presentation: Accelerating EDA Innovation Through SoC Design Methodology Convergence. Logically and effectively he made the case that SoC in... » read more

The Business Of Things


By Frank Ferro The Internet of things (IOT) will create $14 trillion dollars in business opportunities according to Cisco. Unless you are a government accumulating debt, most of us think that’s a big number—and a big opportunity. The much quoted “50 billion connected devices to the Internet by 2020” forecast is the impetus driving companies in all parts of the ecosystem including infra... » read more

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