tag: EDA

DAC Is Where?
By Atrenta - 09 May, 2013 - Comments: 0

By Mike Gianfagna DAC season is upon us. I gave up counting the number of DACs I’ve attended a long time ago—when I turned 29 for the third time, I believe. This year, DAC is special in a few important ways. First of all, it’s the 50th DAC. Yes, the show has indeed been around that long. It started as a workshop with a bunch of engineers debating algorithms. For an industry that is arg... » read more

Taking Aim At Big Data
By Ed Sperling - 25 Apr, 2013 - Comments: 0

By Ed Sperling As the Internet of Things bridges the gap between the mobile and big data worlds, EDA and IP vendors increasingly are looking well beyond their usual boundaries. How successful they are at moving upward into a market that is far less price-sensitive remains to be seen. But from a technology standpoint, at least, the issues encountered by data centers and cloud providers are ... » read more

Design-For-DSA Industry Begins To Assemble
By Mark LaPedus - 18 Apr, 2013 - Comments: 0

By Mark LaPedus The industry is aggressively pursuing directed self-assembly (DSA) as an alternative patterning technology for future chip designs. DSA, which enables fine pitches through the use of block copolymers, is in the R&D pilot line stage today. The fab tools, process flows and materials are basically ready, but there are still several challenges to bring the technology from th... » read more

Supply Chain Catch-Up
By Ed Sperling - 18 Apr, 2013 - Comments: 0

There always will be a few big companies marching to the latest process node available to them. The problem these days isn’t their commitment to pushing forward. It’s the baggage train following them. It’s getting longer, more diverse, and in some cases, it’s falling out of sync. The foundries are out in front with 14nm finFETs, and they’re already working on 10nm transistors—pos... » read more

Executive Briefing: Lip-Bu Tan
By Ed Sperling - 11 Apr, 2013 - Comments: 0

By Ed Sperling LPHP: From a high level, what are your customers doing differently these days? Tan: What system companies are looking for is time-to-market and differentiation. They want to differentiate on specific functions. IT has become very important in this process. And in terms of tools, they are looking for end-to-end solutions. Besides the advanced nodes and IP blocks, they are starti... » read more

Observation Post
By Pranav Ashar - 28 Mar, 2013 - Comments: 0

By Pranav Ashar After attending the 2013 Design and Verification Conference (DVCon) in San Jose, Calif., I have compiled notes as both an observer and a panel participant. Here are my observations: Wally Rhines, CEO of Mentor Graphics, gave the keynote presentation: Accelerating EDA Innovation Through SoC Design Methodology Convergence. Logically and effectively he made the case that SoC in... » read more

The Business Of Things
By Frank Ferro - 28 Mar, 2013 - Comments: 0

By Frank Ferro The Internet of things (IOT) will create $14 trillion dollars in business opportunities according to Cisco. Unless you are a government accumulating debt, most of us think that’s a big number—and a big opportunity. The much quoted “50 billion connected devices to the Internet by 2020” forecast is the impetus driving companies in all parts of the ecosystem including infra... » read more

Market Realities
By Ed Sperling - 28 Mar, 2013 - Comments: 0

The speculation about EDA’s future—will it consolidate, will it be incorporated into large IDMs or foundries—has surfaced again. The reason this time is that EDA is in a retrenchment period as the semiconductor industry grapples with increasing complexity, multiple options ranging from multi-patterning to stacked die to more third-party IP, and the rising cost of complex SoCs at the mo... » read more

Experts At The Table: The Trouble With Low-Power Verification
By Ed Sperling - 14 Mar, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power verification with Leah Clark, associate technical director at Broadcom; Erich Marschner, product marketing manager at Mentor Graphics; Cary Chin, director of marketing for low-power solutions at Synopsys; and Venki Venkatesh, senior director of engineering at Atrenta. What follows are excerpts of that conversat... » read more

Unified Power Intent
By Ed Sperling - 01 Mar, 2013 - Comments: 0

The next version of the Unified Power Format has been approved, bridging the major differences between UPF/IEEE 1801 and the Common Power Format. For anyone who works in low-power verification, this is very good news. The new standard is the result of an unprecedented collaboration by chipmakers and EDA companies, and the people who devised a solution to this problem deserve a big pat on the... » read more

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