Manufacturing Bits: June 18


Making microvias in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, Georgia Institute of Technology, Tokyo Ohka Kogyo (TOK) and Panasonic presented a paper on a technology that enables ultra-small microvias for advanced IC packages. Researchers demonstrated a picosecond UV laser technology as well as materials, which enabled 2μm to 7μm vias... » read more