New market opportunities and global competitiveness are limited by qualified people.
Showing that a processor core adheres to a specification becomes more difficult when the specification is extensible.
Better algorithms and more data could bolster adoption, particularly at advanced nodes.
New approaches are competing for attention as scaling benefits diminish.
Deeper understanding of equipment behavior and market needs will have broad impact across the semiconductor supply chain.
This will go down as a good year for the semiconductor industry, where new markets and innovation were both necessary and rewarded.
Researchers digging into ways around the von Neumann bottleneck.
Experts at the Table, Part 1: Impact on the supply chain, who’s using advanced packaging, and the cost of packaging versus device scaling.
Companies battle it out to get artificial intelligence to the edge using various chip architectures as their weapons of choice.
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
Bulk CMOS, FD-SOI and finFETs all on tap as big players vie for differentiation. But where will chipmakers go after 28nm?
New architectures, packaging approaches gain ground as costs increase, but shrinking features continues to play a role.
New market opportunities and global competitiveness are limited by qualified people.
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