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Digital Test Bulks Up – Or Down


Large digital integrated circuits are becoming harder to test in a time- and cost-efficient manner. AI chips, in particular, have tiled architectures that are putting pressure on older testing strategies due to the volume of test vectors required. In some cases, these chips are so large that they exceed reticle size, requiring them to be stitched together. New testing efficiencies are needed... » read more

STMicroelectronics’ Implementation Of The STAR Hierarchical System And IEEE 1500 Wrapping


This white paper discusses various IEEE 1500 architectures that STMicroelectronics has deployed using the Synopsys DesignWare STAR Hierarchical System test solution. STAR Hierarchical System allows users to optimize test time on system-on-chips that use multiple cores. The white paper provides guidelines on interface IP wrapping with IEEE 1500 to improve test time. In addition, it discusses the... » read more

Test Challenges Grow


Semiconductor Engineering sat down to discuss current and future test challenges with Dave Armstrong, director of business development at Advantest; Steve Pateras, product marketing director for Silicon Test Solutions at Mentor Graphics; Robert Ruiz, senior product marketing manager at Synopsys; Mike Slessor, president of FormFactor; and Dan Glotter, chief executive of Optimal+. SE: In our ... » read more