Interconnects: Criteria For Alternative Metal Benchmarking And Selection (Imec, KU Leuven)


A technical paper titled “Selecting Alternative Metals for Advanced Interconnects” was published by researchers at imec and KU Leuven. Abstract “Today, interconnect resistance and reliability are key limiters for the performance of advanced CMOS circuits. As transistor scaling is slowing, interconnect scaling has become the main driver for circuit miniaturization, and interconnect lim... » read more

Chip Industry Week In Review


Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

New Approaches Needed For Power Management


Power is becoming a bigger concern as the amount of data being processed continues to grow, forcing chipmakers and systems companies to rethink compute architectures from the end point all the way to the data center. There is no simple fix to this problem. More data is being collected, moved, and processed, requiring more power at every step, and more attention to physical effects such as he... » read more

Chip Industry Week In Review


Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Chip Industry Technical Paper Roundup: May 28


New technical papers added to Semiconductor Engineering’s library this week. [table id=229 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


Absolics, an affiliate of Korea materials company SKC, will receive up to $75 million in direct funding under the U.S. CHIPS Act for the construction of a 120,000 square-foot facility in Covington, Georgia, for glass substrates in advanced packaging. imec will host a €2.5 billion (~$2.72B) pilot line for researching chips beyond 2nm, partially funded through the EU Chips Act. imec CEO Luc ... » read more

Sidestepping Lithography In Chip Manufacturing


Rising lithography costs, shrinking feature sizes, and the need for an alternative to copper are collectively spurring new interest in area-selective deposition. An extension of atomic layer deposition, ASD seeks to build circuit features from the bottom up, without relying on lithography. Lithography will remain a critical tool for the foreseeable future. But it has long been the most expen... » read more

Proof-of-Concept On-Chip Flow Cytometer Using Integrated Photonics (imec, Sarcura)


A new technical paper titled "On-chip flow cytometer using integrated photonics for the detection of human leukocytes" was published by researchers at imec and Sarcura GmbH. Abstract "Differentiation between leukocyte subtypes like monocytes and lymphocytes is essential for cell therapy and research applications. To guarantee the cost-effective delivery of functional cells in cell therapies... » read more

Chip Industry Technical Paper Roundup: May 21


New technical papers added to Semiconductor Engineering’s library this week. [table id=227 /] More ReadingTechnical Paper Library home » read more

Demonstrating The Feasibility Of The Foundry Model For Flexible Thin-Film Electronics 


A technical paper titled “Multi-project wafers for flexible thin-film electronics by independent foundries” was published by researchers at KU Leuven and imec. Abstract: "Flexible and large-area electronics rely on thin-film transistors (TFTs) to make displays, large-area image sensors, microprocessors, wearable healthcare patches, digital microfluidics and more. Although silicon-based co... » read more

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