Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Power/Performance Bits: Nov. 7


Speeding up MRAM Researchers at UC Berkeley and UC Riverside developed an ultrafast method for electrically controlling magnetism in certain metals, which could lead to increased performance for magnetic RAM. While the nonvolatility of MRAM is a boon, speeding up the writing of a single bit of information to less than 10 nanoseconds has been a challenge. “The development of a non-volatile... » read more

Trade War Looms Over Materials


It’s time to pay close attention to rare earths and raw materials--again. In fact, the supply chain teams and commodity buyers at aerospace, automotive and electronics companies may have some new and potentially big problems on their hands. For some time, the European Union (EU), the United States and other nations have been at odds with China over rare earths. China, which accounts for... » read more