tag: Intel

What’s After FinFETs?
By Mark LaPedus - 24 Jul, 2017 - Comments: 3

Chipmakers are readying their next-generation technologies based on 10nm and/or 7nm finFETs, but it's still not clear how long the finFET will last, how long the 10nm and 7nm nodes for high-end devices will be extended, and what comes next. The industry faces a multitude of uncertainties and challenges at 5nm, 3nm and beyond. Even today, traditional chip scaling continues to slow as process ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Jul, 2017 - Comments: 1

Fab equipment ASML posted strong sales in the quarter and is apparently nearly sold out of scanners based on extreme ultraviolet (EUV) lithography, according to analysts. “ASML posted strong 2Q results and 2Q guidance, providing further evidence that demand remains high for semiconductor equipment,” said Weston Twigg, an analyst with KeyBanc Capital Markets, in a research note. “Demand d... » read more

5 Takeaways From Semicon
By Mark LaPedus - 20 Jul, 2017 - Comments: 0

At the recent Semicon West trade show in San Francisco, there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs, equipment and packaging. Clearly, though, the show is much smaller with fewer attendees, as compared to past years. Most of the big companies no longer have booths. Hardly any have press events or med... » read more

Foundries Accelerate Auto Efforts
By Mark LaPedus - 20 Jul, 2017 - Comments: 0

Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving. All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced drive... » read more

Is 7nm The Last Major Node?
By Ed Sperling - 20 Jul, 2017 - Comments: 3

A growing number of design and manufacturing issues are prompting questions about what scaling will really look like beyond 10/7nm, how many companies will be involved, and which markets they will address. At the very least, node migrations will go horizontally before proceeding numerically. There are expected to be more significant improvements at 7nm than at any previous node, so rather th... » read more

Blog Review: July 19
By Jesse Allen - 19 Jul, 2017 - Comments: 0

Synopsys' Prishkrit Abrol provides a detailed explanation of how the USB Type-C connector works. Mentor's Ricardo Anguiano examines how the RISC-V ecosystem is expanding and latest developments in the open source toolchain. Cadence's Gopi Krishnamurthy explains the lane margining requirements of the PCIe 4.0 specification. ARM's Chet Babla unravels some claims about Narrowband IoT, Cat... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Jul, 2017 - Comments: 1

Market research SEMI has released its mid-year forecast at Semicon West. SEMI reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase by 19.8% to a total of $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000. In 2018, 7.7% growth is expected, resulting in an... » read more

Blog Review: July 12
By Jesse Allen - 12 Jul, 2017 - Comments: 0

Mentor's Puneet Sinha points to five big engineering stumbling blocks in building commercially-viable autonomous vehicles. Synopsys' Anders Nordstrom checks out some exotic applications of formal verification. Cadence's Paul McLellan listens in on a talk by Cadence's Michelle (Xuehong) Mao on how the company's deep neural network, CactusNet, works for optimizing network architecture. S... » read more

The Week In Review: IoT
By Jeff Dorsch - 07 Jul, 2017 - Comments: 0

Mergers and Acquisitions ARM has acquired Simulity Labs, an Internet of Things security firm in the United Kingdom, for about $15.2 million, a small part of which is held back for a year subject to certain conditions. Foresight Group, a private equity firm, acquired Simulity eight months ago for around $5.2 million, making a handsome profit on the transaction. Simulity provides embedded operat... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Jun, 2017 - Comments: 0

Chipmakers Toshiba and its fab partner, Western Digital, have jointly rolled out a 96-layer 3D NAND product amid a legal dispute. The companies have developed prototype samples of a 96-layer 3D NAND device. Samples of the new 96-layer product, which is a 256 gigabit (32 gigabytes) device, is scheduled for release in the second half of 2017 and mass production is targeted for 2018. Separately, ... » read more

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