tag: Intel

Mask Maker Worries Grow
By Mark LaPedus - 18 Aug, 2016 - Comments: 2

Leading-edge photomask makers face a multitude of challenges as they migrate from the 14nm node and beyond. Mask making is becoming more challenging and expensive at each node on at least two fronts. On one front, mask makers must continue to invest in the development of traditional optical masks at advanced nodes. On another front, several photomask vendors are preparing for the possible ra... » read more

What Transistors Will Look Like At 5nm
By Mark LaPedus - 18 Aug, 2016 - Comments: 3

Chipmakers are currently ramping up 16nm/14nm finFET processes, with 10nm and 7nm just around the corner. The industry also is working on 5nm. TSMC hopes to deliver a 5nm process by 2020. GlobalFoundries, Intel and Samsung are doing R&D for that node. But 5nm technology presents a multitude of unknowns and challenges. For one thing, the exact timing and specs of 5nm remain cloudy. The... » read more

Focus Shifting To Photonics
By Ed Sperling - 17 Aug, 2016 - Comments: 4

Silicon photonics finally appears ready for prime time, after years of unfulfilled expectations and a vision that stretches back at least a couple decades. The biggest challenge has been the ability to build a light source directly into the silicon process, rather than trying to add one onto a chip after manufacturing. [getentity id="22846" e_name="Intel"] today said it has achieved that mi... » read more

Optimization Challenges For 10nm And 7nm
By Brian Bailey - 17 Aug, 2016 - Comments: 0

Optimization used to be a simple timing against area tradeoff but not anymore. As we go to each new node, the tradeoffs become more complicated involving additional aspects of the design that used to be dealt with in isolation. Semiconductor Engineering sat down to discuss these issues with Krishna Balachandran, director of product management for low power products at [getentity id="22032" ... » read more

10nm Race Heats Up
By Mark LaPedus - 16 Aug, 2016 - Comments: 0

The 10nm process and foundry race is heating up, as Intel announced its 10nm technology at its annual conference. As part of the multi-pronged announcement, Intel’s foundry unit forged a major partnership with ARM. Specifically, ARM will make its physical intellectual-property (IP) available on Intel’s 10nm process. Intel, in turn, will offer the IP for foundry customers. And on to... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Aug, 2016 - Comments: 0

Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

Complete Control Through Software
By Jeff Dorsch - 08 Aug, 2016 - Comments: 0

As Industrial Internet of Things (IIoT) applications proliferate in critical infrastructure, such as the power grid and water supply, the importance of the underlying software and the availability of an open-source platform for app development is coming to the forefront. This marks a significant shift, particularly in the industrial and commercial world, where software historically has playe... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Aug, 2016 - Comments: 0

Chipmakers The wearables market has taken another hit. Intel has issued a safety recall for a smartwatch line from its Basis Science subsidiary. "We are issuing this safety recall of the Basis Peak watch because the watch can overheat, which could result in burns or blisters on the skin surface. It is important that you stop using your watch immediately and return it. Although we are stopping ... » read more

Gaps Emerge In Test Flows
By Ed Sperling - 04 Aug, 2016 - Comments: 0

Gaps are showing up in test flows as chipmakers add more analog content and push into more safety-critical applications, exposing more points at which designs need to be tested as well as weaknesses in current tools and methodologies. The cornerstone of the [getkc id="76" kc_name="IoT"], and connected devices such as self-driving cars, is a heavy reliance on [getkc id="187" kc_name="sensors"... » read more

What’s Next For UVM?
By Brian Bailey - 28 Jul, 2016 - Comments: 0

The infrastructure for much of the chip verification being done today is looking dated and limited in scope. Design has migrated to new methodologies, standards and tools that are being introduced to deal with heterogeneous integration, more customization, and increased complexity. Verification methodologies started appearing soon after the release of SystemVerilog. Initially they were inten... » read more

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