tag: Intel

Alternative To x86, ARM Architectures?
By Jeff Dorsch - 07 Jun, 2016 - Comments: 1

Software developed by professors and graduate students from the University of California at Berkeley? That will never fly in the semiconductor industry, right? Maybe they said that about SPICE, four decades ago. The jury is still out on RISC-V (pronounced risk-five) the modular, open-source instruction set architecture created in this decade by Cal professors and students, yet the ISA is gai... » read more

Manufacturing Bits: June 7
By Mark LaPedus - 07 Jun, 2016 - Comments: 0

Intel’s spintronic spectrometer Intel and Stanford University have presented the first results for a technology called a ferromagnetic resonance (FMR) spectrometer. Initially invented and developed by the National Institute of Standards and Technology (NIST), FMR examines the properties of materials for spintronic-based memories. Today’s DRAMs store binary data in tiny capacitors. I... » read more

Executive Insight: Lip-Bu Tan
By Ed Sperling - 06 Jun, 2016 - Comments: 0

Lip-Bu Tan, president and CEO of Cadence, opens up on the next big things, what will drive them, and what will change to make that happen. What follows are excerpts of that conversation. SE: What are the biggest changes in the semiconductor industry over the past year? Tan: The whole system approach to designing hardware and software is really happening now. It will continue to expand fr... » read more

The Numbers Game
By Jeff Dorsch - 02 Jun, 2016 - Comments: 1

Industry executives making presentations on the Internet of Things often cite the famous estimate by Cisco Systems – 25 billion connected devices in 2015 will double to 50 billion connected devices in 2020. Also, the worldwide IoT market will grow 21% a year to $7 trillion by the end of this decade, according to IDC. Billions and trillions are at stake. Many chip companies, especially I... » read more

IoT Designs Evolving
By Ed Sperling - 02 Jun, 2016 - Comments: 0

IoT hardware is beginning to take shape across a variety of vertical markets, and devices are looking far different from the initial concepts. They're smarter, more targeted, and in most cases custom-built for specific applications. The concept of connected things is hardly a new one. Students at Carnegie Mellon University added sensors into a vending machine in the early 1980s to remotely m... » read more

Do Single-Vendor Flows Make Sense Yet?
By Ann Mutschler - 26 May, 2016 - Comments: 0

For many years in the EDA industry, there has been talk of a complete design tool flow from a single vendor, and each of the main EDA players is capable of offering one. But whether they actually do — or should — is an interesting discussion. There are obvious pros and cons on the technical side. But it is the business and marketing issues that are really at the crux of the debate today.... » read more

Executive Insight: K. Charles Janac
By Ed Sperling - 24 May, 2016 - Comments: 0

K. Charles Janac, chairman and CEO of Arteris, sat down with Semiconductor Engineering to talk about what's changing in the automotive market, the impact of big data, and heterogeneous cache coherency. What follows are excerpts of that discussion. SE: What are the big changes you're seeing in semiconductor design? Janac: There are a lot of changes right now. Mobility is slowing down and b... » read more

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

Bulk CMOS Vs. FD-SOI
By Mark LaPedus - 19 May, 2016 - Comments: 2

The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

What Happened To DSA?
By Mark LaPedus - 19 May, 2016 - Comments: 2

Directed self-assembly (DSA) was until recently a rising star in the next-generation lithography (NGL) landscape, but the technology has recently lost some of its luster, if not its momentum. So what happened? Nearly five years ago, an obscure patterning technology called [gettech id="31046" t_name="DSA"] burst onto the scene and began to generate momentum in the industry. At about that t... » read more

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