tag: Intel

Another Inventory Glut?
By Jim Feldhan - 16 Oct, 2014 - Comments: 0

For nearly a year, Semico’s IPI index has been indicating that the fundamental demand in the second half of 2014 would be seasonally weak. Back in early 2013, our initial view for 2014 was a 10% market growth. However, as the IPI declined in the second half of 2013 we revised our semiconductor revenue forecast down to 7.3% heeding the warning that was projected by the Semico IPI index. This w... » read more

The Week In Review: Design
By Ed Sperling - 10 Oct, 2014 - Comments: 0

IP Synopsys rolled out verification IP for mobile PCIe, including built-in M-PHY, for UVM environments. Cadence introduced MIPI SoundWire controller IP, which allows bi-directional digital communication using low gate count and minimal complexity. Deals ARM and TSMC rolled out a road map for 64-bit ARM-based processors at 10nm. The companies said the early pathfinding work is expected t... » read more

Embedded At DAC
By Anne Cirkel - 10 Oct, 2014 - Comments: 0

It seems to be one of DAC’s best kept secrets – right up there with what happened to Free Monday – that about 30% of the conference content is focused on embedded systems and software (ESS). The call for contributions is still open and I want to remind you that you can submit your research work in ESS to DAC. When Leon Stok of IBM was General Chair for the 48th DAC he started our embedded... » read more

Driving Memory Beyond DDR4
By Frank Ferro - 09 Oct, 2014 - Comments: 0

While attending recent technology trade shows, the Intel Developer’s Forum (IDF) in August and last week’s ARM TechCon, I participated in many interesting discussions around server performance, power consumption, memory bandwidth and capacity. The race to introduce higher-performing servers that consume less power is fueled by the growing demand for new applications in the enterprise, commu... » read more

Multi-Die Packaging Gains Steam
By Si2 - 06 Oct, 2014 - Comments: 0

By Herb Reiter Many readers will be familiar with my extensive background and focus in the emerging field of 3D IC technology, including both 3D stacked die and 2.5 interposer design flows. Now, I am excited to bring my expertise and passion to Silicon Integration Initiative (Si2), where I am now Director of 3D Programs, helping Si2’s members in the Open3D Technical Advisory Board develop pr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Oct, 2014 - Comments: 0

Jimmy Kimmel, comedian and late night host of Jimmy Kimmel Live, replaces Lily Collins (Mirror, Mirror) as McAfee’s most dangerous celebrity to search for online. Cybercriminals are looking for ways to take advantage of consumer interest around popular cultural events. These criminals capitalize on the public’s fascination with celebrities to lure them to sites laden with malware, which ena... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 Sep, 2014 - Comments: 0

Is the sky falling on the ATE market? The ATE market is expected to hit $2.8 billion in 2014, up from $2.28 billion in 2013, according to Pacific Crest Securities. “Overall, we are now modeling overall semiconductor test demand to decline by 2% in 2015, a significant change from our previous estimate of up 10%,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “Te... » read more

Which Comes First?
By Ed Sperling - 25 Sep, 2014 - Comments: 0

Methodologies in IC design typically follow tools. The tools enable the methodologies, and chipmakers' businesses are built around both of them. That has been the rock-solid foundation for the design and production of chips since well before the impenetrable 1-micron wall. But that approach is falling apart at 28nm, and it will continue to crumble at 16/14nm and 10nm. It simply isn't fast en... » read more

Manufacturing Bits: Sept. 23
By Mark LaPedus - 23 Sep, 2014 - Comments: 0

The annual IEEE International Electron Devices Meeting (IEDM) will take place in San Francisco from Dec. 15-17. As usual, there will be presentations on the latest technologies in a number of fields, such as semiconductors, bio‐sensors, energy harvesting, power devices, sensors, magnetics, spintronics, two-dimensional electronics, among others. Here’s just some of the papers that will be pr... » read more

Why Investments At Advanced Nodes Matter
By Ed Sperling - 18 Sep, 2014 - Comments: 0

Despite all the talk about rising costs of development, uncertainties about lithography and talk about the death of Moore’s Law, a record number of companies are developing chips at 16nm/14nm. That may sound surprising, but asking why that’s happening is probably the wrong question. The really critical question is what they’re going to do with those chips. What’s become quite evident... » read more

← Older posts Newer posts →

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy