5 Takeaways From ISS 2018


At the recent Industry Strategy Symposium (ISS) in Half Moon Bay, Calif., there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs and equipment. As part of the program, ISS also discussed the latest business and technology trends. In no particular order, here are my five takeaways from ISS: Ranging forecasts ... » read more

Transistor Options Beyond 3nm


Despite a slowdown in chip scaling amid soaring costs, the industry continues to search for a new transistor type 5 to 10 years out—particularly for the 2nm and 1nm nodes. Specifically, the industry is pinpointing and narrowing down the transistor options for the next major nodes after 3nm. Those two nodes, called 2.5nm and 1.5nm, are slated to appear in 2027 and 2030, respectively, accord... » read more

Dawn Of The Data-Centric Era


A recurring theme of the recent Industry Strategy Symposium (ISS) in Half Moon Bay, California, was how the explosion of new applications such as autonomous vehicles, digital healthcare, quantum computing, and crytocurrency mining are driving the need for more industry-wide collaboration to enable companies to compete in the “Data Centric” era. The resulting digital economy is creating unpr... » read more

Follow The Moving Money


Semiconductor economics are changing by market, by region, and by product node and packaging type, adding new complexity into decisions about which technology to use for which products and why. Money is the common denominator in all of these decisions, whether it's measured by return on invested capital, quarterly profits, or long-term investments that can include acquisitions, organic growt... » read more

5 Takeaways From ISS


At the recent Industry Strategy Symposium (ISS) in Half Moon Bay, Calif., there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs and equipment. It also discussed the latest business and technology trends. In no particular order, here are my five takeaways from ISS: Bullish outlook Citing an inventory corre... » read more

The Week In Review: Manufacturing


Chipmakers IC Insights has released its rankings of the top 10 pure-play foundries in 2016. TSMC was the largest foundry in terms of sales, followed by GlobalFoundries, UMC, and SMIC, according to IC Insights. TSMC held a 59% share in 2016. According to IC Insights, the three top-10 pure-play foundry companies that displayed the highest growth rates in 2016 were X-Fab (54%), SMIC (31%) and To... » read more

Will 3D-IC Work?


Advanced packaging is becoming real on every level, from fan-outs to advanced fan-outs, 2.5D, and 3D-ICs for memory. But just how far 3D and monolithic 3D will go isn't clear at this point. The reason is almost entirely due to heat. In a speech at SEMI's Integrated Strategy Symposium in January, Babek Sabi, Intel corporate VP and director of assembly and test technology development, warned t... » read more

The Week In Review: Manufacturing


Savioke is creating autonomous robot helpers for the services industry, including hotels. The company has raised $15 million in Series A financing from lead investor Intel Capital, along with EDBI, the corporate investment arm of the Singapore Economic Development Board, and Northern Light Venture Capital. Savioke will use the funding to expand sales, marketing and product developments for its ... » read more

The Week In Review: Manufacturing


South Korea’s SK Hynix led the initial charge in the development of High Bandwidth Memory (HBM), a 3D DRAM technology based on a memory stack and through-silicon vias (TSVs). SK Hynix has been shipping HBM parts in the market. Now, SK Hynix and Samsung are readying the next version of the technology, dubbed High Bandwidth Memory 2 or HMB2, according to a report from The Electronic Times of So... » read more

The Growing Role Of Extended Supply Chain Collaboration


At the executive keynote panel held at Semicon West 2015, one of the key industry challenges discussed was the growing need for closer collaboration between supply chain partners in order to support the fast time to market and shortened product lifecycles of today’s consumer electronics. Traditionally, the yield ramp phase has been a critical time to resolve manufacturing issues, enable high ... » read more

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