Yield Is Top Issue For MicroLEDs


MicroLED display makers are marching toward commercialization, with products such as Samsung’s The Wall TV and Apple’s smart watch expected to be in volume production next year or in 2024. These tiny illuminators are the hot new technology in the display world, enabling higher pixel density, better contrast, lower power consumption, and higher luminance in direct sunlight — while consu... » read more

Bump Co-Planarity And Inconsistencies Cause Yield, Reliability Issues


Bumps are a key component in many advanced packages, but at nanoscale levels making sure all those bumps have a consistent height is an increasing challenge. Without co-planarity, surfaces may not properly adhere. That can reduce yield if the problem is not identified in packaging, or it can cause reliability problems in the field. Identifying those issues requires a variety of process steps... » read more

Week In Review: Semiconductor Manufacturing, Test


Micron selected Syracuse, New York as the site for its new megafab complex, which is expected to create 9,000 company jobs and 40,000 construction and supply chain jobs. President Biden called it “another win for America.” The chip manufacturing facility will be the nation’s largest, including a 7.2 million square foot complex and 2.4 million square foot of cleanroom. Site preparation wil... » read more

Enabling Test Strategies For 2.5D, 3D Stacked ICs


Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield.  Many changes need to fall into place to make side-by-side 2.5D and 3D stacking approaches cost-effective, particularly for companies looking to integrate chiplets from different vendors. Today, nearly all of t... » read more

KLA Publishes 2021 Global Impact Report And Shares New Climate Goals


KLA is publishing its latest Global Impact Report, detailing progress of our environmental, social and governance (ESG) programs, results and commitments from the past year. Managing our ESG impact is an important part of our mission to advance humanity through devices and ideas that transform our world and help shape a better future for generations to come. “Our accomplishments in 2021 w... » read more

Surfscan SP3/Ax Unpatterned Wafer Inspection Systems


Unpatterned wafer inspection systems are used for process qualification, tool qualification, tool monitoring, outgoing wafer quality control, incoming wafer quality control, and process debug. Learn more about a system from KLA that identify defects and wafer surface quality issues that affect the performance and reliability of chips manufactured for the automotive, IoT, 5G, consumer electronic... » read more

MicroLEDs Move Toward Commercialization


The market for MicroLED displays is heating up, fueled by a raft of innovations in design and manufacturing that can increase yield and reduce prices, making them competitive with LCD and OLED devices. MicroLED displays are brighter and higher contrast than their predecessors, and they are more efficient. Functional prototypes have been developed for watches, AR glasses, TVs, signage, and au... » read more

Week In Review: Manufacturing, Test


Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility California will ban the sale of new gasoline vehicles so that by 2035 100% of new cars and light trucks sold in California will be zero-emission vehicles. NXP Semiconductors announced multi-year supply agreements for its S32 family. Agreements to supply the S32 domain and zonal automotive processors to OEMs will include upcoming 5nm ASIL-D processors. Keysight Techno... » read more

Plasma Dicing 101: The Basics


Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A saw blade, or laser, is used to cut the wafer along the areas between the chips called dicing lanes. This step separates the chips from the wafer making them ready to be packaged and fitted to whiche... » read more

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