Research Bits: May 5


AI power prediction Researchers from MIT and the MIT-IBM Watson AI Lab developed a prediction tool that can quickly tell data center operators how much power will be consumed by running a particular AI workload on a certain processor or AI accelerator chip. It can be applied to a wide range of hardware configurations. The lightweight estimation model captures the power usage pattern of a GP... » read more

Research Bits: Apr. 15


Shape-morphing OLED panel with built-in speaker Researchers from Pohang University of Science and Technology (POSTECH) developed a flexible OLED panel that can freely transform its shape while simultaneously functioning as a speaker. The design is based on a based on a specialized ultra-thin piezoelectric polymer actuator that when integrated into a flexible OLED panel enables electrically ... » read more

Chip Industry Week In Review


Intel CEO Pat Gelsinger retired on Dec. 1, according to the company. He will be replaced by two interim co-CEOs, David Zinsner, who also continues to serve as CFO  and Michelle Johnston Holthaus, who has been named CEO of Intel Products. In addition, Frank Yeary was named interim executive chairman. Intel has been under pressure investors as non-traditional rivals, including Arm and NVIDIA, co... » read more

Research Bits: July 11


Modeling ALE Scientists at U.S. Department of Energy’s (DOE) Princeton Plasma Physics Laboratory (PPPL), in coordination with Lam Research, modeled atomic layer etching (ALE) for semiconductor fabrication. “This would be one little piece in the whole process,” said David Graves, associate laboratory director for low-temperature plasma surface interactions at PPPL and a professor in th... » read more

Direct Chemisorption-Assisted Nanotransfer Printing with Wafer-Scale Uniformity and Controllability


New academic paper from Nanyang Technological University, Korea Institute of Machinery & Materials, and Southwest Jiaotong University. Abstract "Nanotransfer printing techniques have attracted significant attention due to their outstanding simplicity, cost-effectiveness, and high throughput. However, conventional methods via a chemical medium hamper the efficient fabrication with large-area... » read more