Chip Industry Week in Review


Samsung reportedly is hiking memory chip prices by 30% to 60% due to high demand from AI data centers and constrained supplies. Those shortages are causing ripples elsewhere. SMIC, China's largest foundry, said its customers are holding back orders for other types of semiconductor due to concerns about memory supplies. Meanwhile, interest in photonics and power semiconductors is picking up, ... » read more

Ensuring Reliability Becomes Harder In Multi-Die Assemblies


Multi-die assemblies are bringing together a variety of materials and processes with distinctly different physical properties, creating significant challenges in manufacturing and packaging that can impact yield at time zero and reliability in the field. What passes electrical screening at the end of the line may look good on paper, but these devices can still fail once exposed to rapid and ... » read more

Using Virtual Twins To Accelerate The Transition From Layout To Semiconductor Manufacturing


Standard electronic design automation (EDA) tools can be used to produce a semiconductor layout, which can be used to manufacture a device with targeted performance specifications. Unfortunately, designers have learned from experience that process capabilities on semiconductor manufacturing equipment can limit device yield and performance of any idealized device layout. Even though every... » read more

Chip Industry Week in Review


Retaliations and countermoves leading up to planned trade talks between the U.S. and China led experts to wonder, 'Who's winning?' New activity on this front: China issued questionnaires to some U.S. semiconductor firms as part of an anti-dumping probe, demanding detailed data on sales, profit margins, logistics costs and Chinese customer names for analog chips. The probe appears aimed at ... » read more

Powering Efficiency: AI Transforms IC Manufacturing As ICs Fuel AI


The push to grow today’s $500 billion-plus semiconductor industry to $1 trillion in annual revenue is challenging every aspect of the broader supply chain to embrace AI. Artificial intelligence is transforming the way fabs are architected and run, how devices are manufactured, and how server farms are constructed going forward. At the same time, all of this is being enabled by advancements... » read more

Chip Industry Week in Review


The Open Compute Project (OCP) Summit kicked off this week in San Jose, dominated by open standards, massive scaling of AI infrastructure, chiplet architectures, and energy-efficiency. Among the highlights: An initiative to standardize data center infrastructure and advance Ethernet for AI. New contributions to OCP's Open Chiplet Economy ecosystem, including Arm's new Foundation Chiplet... » read more

Chip Industry Week in Review


SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

Chip Industry Week In Review


U.S. Trade Representative Jamieson Greer warned Southeast Asian semiconductor manufacturers that they must shift production to the U.S. or face new punitive tariffs, reports the South China Morning Post. President Trump previously floated a 100% tariff on imported chips. Malaysia and other regional economies are offering large concessions and promises of U.S. goods purchases in hopes of securin... » read more

Chip Industry Week in Review


Amkor, TSMC, and Cadence partnered with Tesoro VC, which will serve as the lead operator of a new Global AI + Semiconductor Startup Hub and a Global Design Center in Phoenix, Arizona, aimed at chip innovation, startup growth, and advanced manufacturing. Nvidia will invest $5 billion in Intel common stock at a purchase price of $23.28 per share and the companies will collaborate on AI infrastru... » read more

Breaking The Copper Bottleneck With Molybdenum Hybrid Metallization


Scaling the back end of line (BEOL) in advanced semiconductor logic devices is a major challenge. Metal lines and via filling in BEOL have historically used copper (Cu) as the electrical conductor. But as device dimensions shrink, Cu use has become problematic. The small critical dimensions (CD) of the Cu metal lines and vias in the latest BEOL structures have created an increase in resistance,... » read more

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