The Week In Review: Manufacturing


Samsung Electronics announced that its memory fabrication line in Xi’an China has begun full-scale manufacturing operations. The new facility will manufacture Samsung’s advanced NAND flash memory chips, dubbed 3D V-NAND. A recent chemical leak at Intel’s fab in Arizona was contained and two workers were taken to a hospital for observation, according to reports. Apparently, Intel was i... » read more

New Low-Power Memory Interface Ahead


By Pallab Chatterjee The trend in consumer electronic devices is toward a multimedia-centric data flow, forcing changes in the memory interface needed to handle it. The increased compute resources needed for video signal processing, along with high-definition audio, used to be the exclusive domain of mainstream desktop computers and servers due to their access to memory and high data throug... » read more

One On One With South Korea’s CTO


By Ed Sperling Chang-Gyu Hwang, national chief technology officer for South Korea, sat down with Low-Power Engineering to talk about the future trends in technology, global business and power. Prior to his current role, which was created by the Korean government in April, he ran the semiconductor business at Samsung, where he spent the last 20 years in top management positions. He also is the... » read more

Where The Jobs Are


The job market for design and verification engineers seems to be exploding. In the past week, listings have been flooding onto jobs boards for LinkedIn semiconductor design groups. The only trouble is engineers may have to move to get the jobs—sometimes halfway around the globe. There have been a bunch of job postings for semiconductor expertise in India, the United Kingdom, as well as pla... » read more

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