tag: mixed signal

What’s Next For UVM?
By Brian Bailey - 28 Jul, 2016 - Comments: 0

The infrastructure for much of the chip verification being done today is looking dated and limited in scope. Design has migrated to new methodologies, standards and tools that are being introduced to deal with heterogeneous integration, more customization, and increased complexity. Verification methodologies started appearing soon after the release of SystemVerilog. Initially they were inten... » read more

Mixed-signal/Low-power Design
By Jeff Dorsch - 26 Jul, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss mixed-signal/low-power IC design with Phil Matthews, director of engineering at Silicon Labs; Yanning Lu, director of analog IC design at Ambiq Micro; Krishna Balachandran, director of low power solutions marketing at [getentity id="22032" comment="Cadence"]; Geoffrey Ying, director of product marketing, AMS Group, [getentity id="22035" e_name="Syno... » read more

Addressing The Challenges Of Automotive Motor Control
By Ahmed Eisawy - 14 Jul, 2016 - Comments: 0

By Andrew Talan and Ahmed Eisawy As you leave work today and enter the parking lot, you hit the unlock button on your car remote. Using the power lift to open the hatch back, you put your laptop bag in the back of the car. While seated in the car, you adjust your seat position and bump your driver-side mirror into a new position and then head for home. You probably don’t think much about y... » read more

Mixed-Signal/Low-Power Design
By Jeff Dorsch - 14 Jul, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss mixed-signal/low-power IC design with Phil Matthews, director of engineering at Silicon Labs; Yanning Lu, director of analog IC design at Ambiq Micro; Krishna Balachandran, director of low power solutions marketing at [getentity id="22032" comment="Cadence"]; Geoffrey Ying, director of product marketing, AMS Group, [getentity id="22035" e_name="Syno... » read more

A New Approach For IC Test
By NI - 22 Jun, 2016 - Comments: 0

Since its inception, a founding principle of the semiconductor industry has been to continually improve performance while driving down cost. In other words, offer more for the money. However, amid greater device complexity, shorter product cycles, and relentless cost pressure, the test portion represents an increasing percentage of the total IC cost and a significant part of the product develop... » read more

DAC Day Two: Down To Business
By Brian Bailey - 07 Jun, 2016 - Comments: 0

DAC day two started with a breakfast presentation put on by Synopsys which included guests from ARM, TSMC and HiSilicon. It was titled Collaborating to Enable Design with the latest processors and finFET processes. Collaboration is a word that we hear increasingly when talking about the advanced nodes and today we are truly at the point where one company cannot do it all. Ron Moore, VP of ma... » read more

End Of Mixed Signal Engineering?
By Ed Sperling - 04 May, 2016 - Comments: 1

EDA companies are stepping back after years of trying to force engineers to combine analog and digital disciplines. Rather than emphasizing [getkc id="38" kc_name="mixed signal"] as a single expertise, they are building bridges and translation mechanisms between the two worlds. The moves cap more than a decade of trying to find optimal ways to pack [getkc id="37" kc_name="analog"] and digita... » read more

Power Integrity Optimization Cuts RF Substrate Noise
By Tobias Bjerregaard - 14 Apr, 2016 - Comments: 0

Our main focus is on dynamic voltage drop at 16-14-10nm and beyond, but the rise of the Internet of Things (IoT) prompted me to share some silicon measurement results that are relevant to the RF design community. Normally, power integrity (PI) is looked at in the time domain, but in this work we looked at it from a frequency spectrum perspective. Silicon measurements prove how shaping the dynam... » read more

Mixed-Signal Design Powers Ahead
By Ann Mutschler - 10 Mar, 2016 - Comments: 1

Mixed-signal devices are at the heart of many advanced systems today because of the need to interact with the outside world, but designing and verifying these systems is getting harder. There are several reasons for this. First, almost all of these devices now have to be lower power than in the past, and in the analog space it's not as simple as just dialing down part of a block. Second, it ... » read more

IoT Design Challenges
By Jeff Miller - 04 Feb, 2016 - Comments: 0

Low-cost IoT designs that interface with the real world incorporate multiple design domains that individually are challenging for today’s engineers, so it’s no surprise that putting them all together creates extreme pressure on IoT design teams. The typical IoT device contains a sensor and an actuator that interface to the Internet. The sensor creates a signal based on some real-world ac... » read more

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