Intel Vs. Samsung Vs. TSMC
Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.
Chip Industry Week In Review
Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.
Chip Industry Week In Review
DAC; CHIPS funding; CXL standards; Nexperia investment; US curbs tech investments; Accellera's Federated Simulation Group; European sustainability concerns; SIA's tracking tool; Multibeam's multicolumn litho system.
Chip Industry Week In Review
Leading-edge foundry plans; DoD IC center; 300mm funding; Intel's apprenticeship program; metrology and test acquisitions; Keysight's chiplet PHY simulation; thermal management in 3D-ICs; foundry growth.
Startup Funding: Q2 2024
Big rounds for AI chips; 91 startups raise $2.6 billion.
Intel Vs. Samsung Vs. TSMC
Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.
Electromigration Concerns Grow In Advanced Packages
Higher density, heat, and more materials make it harder to ensure reliability.
The Race To Glass Substrates
Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.
What Works Best For Chiplets
Not all chiplets are interchangeable, and options will be limited.
Controlling Warpage In Advanced Packages
Mechanical stresses increase with larger sizes and heterogeneous materials.
Architecting Chips For High-Performance Computing
Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.
EDA Looks Beyond Chips
System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.
