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Week in Review: IoT, Security, Autos


Products/Services Rambus reports completing its acquisition of Northwest Logic, a supplier of memory, PCIe, and MIPI digital controllers. Meanwhile, the company named Sean Fan as chief operating officer. He previously served as vice president and general manager of the data center business unit at Renesas Electronics. Prior to its acquisition by Renesas earlier this year, Fan held senior execu... » read more

Week In Review: Design, Low Power


Rambus completed its acquisition of Northwest Logic, a supplier of memory, PCIe and MIPI digital controllers. The Hillsboro, OR office of Northwest Logic will remain in place, along with the entire staff. SureCore launched a new low power design service. The company's offering includes concept-to-tape-out low power mixed-signal design expertise such as design and layout capabilities, technol... » read more

Week in Review: IoT, Security, Auto


Products/Services Rambus agreed to acquire Hillsboro, Ore.-based Northwest Logic, a purveyor of memory, PCIe, and MIPI digital controllers. The transaction is expected to close in the current quarter. Financial terms weren’t disclosed; Rambus said in a statement, “Although this transaction will not materially impact 2019 results due to the expected timing of close and acquisition accountin... » read more

Week In Review: Design, Low Power


Rambus will acquire Northwest Logic, a maker of digital controller IP for memory, PCIe and MIPI. "Northwest Logic’s category-leading digital controllers fit perfectly with Rambus’ leadership portfolio of high-speed PHY solutions," said Northwest Logic president and CEO Brian Daellenbach. "This deal creates a one-stop-shop for SoC designers working on state-of-the-art applications across a b... » read more

Week In Review: Design, Low Power


Tools & IP Cadence uncorked the latest version of JasperGold formal verification platform, providing improvements to the proof-solver algorithm and orchestration by using machine learning to select and parameterize solvers to enable faster first-time proofs and optimize successive runs for regression testing. Additionally, it increases design compilation capacity by over 2x with 50% reduct... » read more

The Week In Review: Design


M&A IoT-focused memory chipmaker Adesto Technologies acquired S3 Semiconductors, a provider of mixed-signal and RF ASICs and IP. Based in Ireland, S3 Semiconductors was founded in 1986. S3 Semiconductors will become a business unit of Adesto and will continue to operate under its current model in the $35 million deal. S3 Semiconductor's parent company, S3 Group, will continue as a separate... » read more

The Week In Review: Design


Tools & IP Cadence unveiled its latest DSP for embedded vision and AI, Tensilica Vision Q6 DSP. The DSP is built on a 13-stage processor pipeline and new system architecture designed for use with large local memories, and achieves 1.5GHz peak frequency and 1GHz typical frequency at 16nm. Compared to its predecessor, it offers 1.5X greater vision and AI performance than its predecessor and ... » read more

AI: The Next Big Thing


The next big thing isn't actually a thing. It's a set of finely tuned statistical models. But developing, optimizing and utilizing those models, which collectively fit under the umbrella of artificial intelligence, will require some of the most advanced semiconductors ever developed. The demand for artificial intelligence is almost ubiquitous. As with all "next big things," it is a horizonta... » read more

The Week In Review: Design


Security Addressing the Meltdown and Spectre speculative execution vulnerabilities has not gone smoothly. Intel's firmware update caused unexpected behavior and a higher than expected number of reboots for its Haswell and Broadwell chips, leading the company to recommend users stop patching until an updated version of the patch is available. Microsoft's attempts to fix the issue left some W... » read more

In Case You Missed It


We recently held two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic p... » read more

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