Chip Industry Week In Review


Space Forge autonomously generated plasma aboard its ForgeStar-1 satellite, utilizing extreme low Earth orbit (LEO) conditions needed for gas-phase crystal growth of wide- and ultra-wide bandgap materials, GaN, SiC, aluminum nitride, and diamonds. Copper prices surged to a historic record of $12,600 per metric ton, an increase of more than 40% YOY, which will impact the cost of data center b... » read more

Chip Industry Week In Review


Deals: NVIDIA inked a $20B non-exclusive licensing deal with Groq for its inference technology. The startup's founder, Jonathan Ross, and some other employees will join NVIDIA to assist in scaling and advancing the technology. The non-exclusive licensing deal, versus an outright purchase, is a tool other companies have used to avoid antitrust regulation. Samsung Ventures made a strategic inv... » read more

When To Move To Multi-Die Assemblies


As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it's often not feasible to fit everything onto a single planar die. But determining when to move to a multi-die assembly isn't always straightforward. Multi-die approaches have some well-documented benefits. They allow designers to split functions across different dies, which can impro... » read more

Chip Industry Technical Paper Roundup: Dec 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=506 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review. » read more

Chip Industry Week in Review


Government funding/defunding NIST is terminating funding for the SMART USA Institute, a CHIPS Act research center focused on digital twins, prompting congressional concern that the decision disrupts active awards and weakens U.S. semiconductor R&D commitments. Korea Zinc was awarded $210M in CHIPS Act funding towards a new $6.6B Tennessee advanced smelter and minerals processing facility,... » read more

Chip Industry Technical Paper Roundup: Dec. 16


New technical papers recently added to Semiconductor Engineering’s library: [table id=501 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review. » read more

Efficient Synchronous Dataflow Execution For GPUs (NVIDIA, UW-Madison)


A new technical paper titled "Kitsune: Enabling Dataflow Execution on GPUs with Spatial Pipelines" was published by researchers at NVIDIA and the University of Wisconsin-Madison. Abstract "State-of-the-art DL models are growing in size and complexity, with many modern models also increasing in heterogeneity of behavior. GPUs are still the dominant platform for DL applications, relying on ... » read more

Chip Industry Week in Review


Deals of the week: Arteris announced plans to acquire cybersecurity provider Cycuity. “Expanding our technology portfolio to include Cycuity’s hardware security assurance products will enable our customers to achieve secure on-chip data movement,” said Charlie Janac, chairman and CEO of Arteris. Qualcomm acquired Ventana Micro Systems, a maker of RISC-V data center-class CPU IP. ... » read more

AI Techniques To Solve HW-SW Challenges For Useful Quantum Computing (Nvidia, U. of Oxford et al.)


A new technical paper "Artificial intelligence for quantum computing" was published by researchers at NVIDIA, University of Oxford, University of Toronto, Quantum Motion, University of Waterloo et al. Abstract "Artificial intelligence (AI) advancements over the past few years have had an unprecedented and revolutionary impact across everyday application areas. Its significance also extend... » read more

Chip Industry Week in Review


Major Deals: Taiwan-based UMC is exploring possible collaboration with Polar Semiconductor for high-volume production of 8-inch wafers at Polar’s expanded Minnesota fab, a move that could provide domestic manufacturing capacity for automotive, data center, consumer, aerospace, and defense customers. Marvell will acquire Celestial AI for $3.25B, adding photonic fabric technology for o... » read more

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