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Managing Wafer Retest


Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and result in poor yield, as well as failures in the field. Achieving this balance requires good wafer probing process procedures as well as monitoring of the resulting process parameters, much of it ... » read more

Eliminating Ground-Loop Induced Noise


As semiconductor device performance increases, especially for low power and higher speed ICs, testing low frequency 1/f, RTN and phase noise with improved signal-to-noise ratio is required. Finding and eliminating unwanted noise is required in multiple areas. Noise sources can be found inside a prober, outside a prober, and in a measurement TestCell. Historically, TestCell-generated noise was o... » read more

Heating Up Cryogenic Wafer Testing


The use of on-wafer superconducting materials, other novel materials, and traditional semiconductors at cryogenic temperatures (below about 123K, or -150°C) has grown quickly in recent years. Inventive new sensors take advantage of unique material properties at very low temperatures to detect a wide variety of physical phenomena such as infrared radiation, magnetic fields, x-rays, and more. T... » read more

Service Agreements For Probe Systems


Having a Probe Systems Service Agreements can bring simplicity and peace of mind when it comes to keeping equipment operating at optimum performance. We take the guesswork out of maintenance budgeting by providing parts and labor coverage at a single, low cost. Priority service and part delivery eliminates time wasted waiting for maintenance or repair parts. Comprehensive, scheduled preve... » read more