Chip Industry Technical Paper Roundup: Dec 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=506 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review. » read more

Analysis of Thermal and Mechanical Behavior for Advanced Packaging (Sungkyunkwan Univ. et al)


A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations” was published by researchers at Sungkyunkwan University, Korea Institute of Industrial Technology, Korea University, Seoul National University, and Pukyong National University. Abstract Excerpt “... » read more