A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations” was published by researchers at Sungkyunkwan University, Korea Institute of Industrial Technology, Korea University, Seoul National University, and Pukyong National University.
Abstract Excerpt
“As the thermo-mechanical behavior of packages becomes more complex, the integration of mechanics, material property determination, and structural considerations will be crucial in understanding and optimizing microelectronics packaging. ”
Find the technical paper here. December 2025.
Park, Jeong-Hyeon, Eunhye Lee, Im-Deok Kim, Hyunwoo Jung, Jihyun Kim, Jungwan Cho, Jong-hyoung Kim, Tae-Ik Lee, Seung-Kyun Kang, and Eun-Ho Lee. “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations.” Materials Science in Semiconductor Processing 205 (2026): 110321. Creative commons license.
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