tag: Rambus

EDA Sets New Record
By Ed Sperling - 13 Apr, 2015 - Comments: 0

EDA revenue grew 11.9% in Q4 2014 to $2.1 billion, a new record for the industry, propelled by strong growth in both IP and physical design. On a sequential basis, that represented a 15.1% increase, while on a year-over-year basis it was 11.9%. The four-quarter moving average, which takes into account quarterly aberrations, showed a 7.3% increase. "The semiconductor industry had a strong ... » read more

The Week In Review: Design/IoT
By Jesse Allen - 10 Apr, 2015 - Comments: 0

Certifications TSMC certified a number of tools for its current 10nm FinFET design rules and SPICE models and 16nm FinFET Plus (16FF+) V1.0 process, including: Ansys' power integrity and electromigration tools; Cadence's custom/analog and digital implementation and signoff tools; Mentor Graphics' physical verification, design for manufacturing, and circuit verification tools; and Synopsys' ful... » read more

Stacked Die, Phase Two
By Ed Sperling - 09 Apr, 2015 - Comments: 0

The initial hype phase of [getkc id="82" kc_name="2.5D"] appears to be over. There are multiple offerings in development or on the market already from Xilinx, Altera, Cisco, Huawei, IBM, AMD, all focused on better throughput over shorter distances with better yield and lower power. Even Intel has jumped on the bandwagon, saying that 2.5D will be essential for extending [getkc id="74" comment="M... » read more

Drill Down: Embedded NVM Technology
By Ernest Worthman - 02 Apr, 2015 - Comments: 0

Many of the next-generation devices that will be seen on the IoT/E will have power, footprint, and electronic constraints as never before. Electronic flash memories (eFLASH), and their derivatives are seen as a realistic solution to many of these design constraints for small form factor and simple IoE devices. “NVM will be very important for the IoE from the perspective of saving power," ... » read more

Blog Review: April 1
By Jesse Allen - 01 Apr, 2015 - Comments: 0

A Russian plan to build a massive cargo plane to deliver tanks at supersonic speed—A roll of tape coated in squid proteins provides perfect camouflage—A yacht made of volcanic fibers battling the world's roughest seas: Ansys' Justin Nescott finds everything for a James Bond movie in this week's top tech articles. Writing for Synopsys, Broadcom's Hari Balisetty looks at reusable sequences... » read more

Architecting For Optimal Interface IP Integration
By Ann Mutschler - 31 Mar, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss the design and integration of complex interface IP with Ty Garibay, vice president of engineering at [getentity id="22849" e_name="Altera"]; Brian Daellenbach, president of Northwest Logic; Frank Ferro, senior director of product management for memory and interface IP at [getentity id="22671" e_name="Rambus"]; Saman Sadr, director of analog design... » read more

The Week In Review: Design/IoT
By Jesse Allen - 27 Mar, 2015 - Comments: 0

Tools Mentor Graphics uncorked its new IC, package, and PCB co-design and optimization product. It includes a formal flow for ball grid array ball-map planning and optimization based on an "intelligent pin" concept and a multi-mode connectivity management system for cross-domain pin-mapping and system level cross-domain logical verification. Synopsys released a new tool for designing ASIP... » read more

Blog Review: March 25
By Jesse Allen - 25 Mar, 2015 - Comments: 0

From brain implants that recover memories to color-shifting shoes, Ansys' Bill Vandermark features sci-fi visions of the future that are becoming reality in his top five tech picks of the week. In the world of embedded software, is a black box better? Mentor's Colin Walls questions whether the advantages that come of having full access to source code outweigh the downsides. Cadence's Neel... » read more

Blog Review: March 18
By Jesse Allen - 18 Mar, 2015 - Comments: 0

How do you quantify effort spent in FPGA verification? Mentor's Harry Foster tackles the question in his latest installment of the Wilson Research Group functional verification study. A new frontier of design challenges is rapidly emerging, according to ARM CEO Simon Segars. Cadence's Brian Fuller brings us his keynote address at CDNLive. Synopsys' Tushar Mattu is back with more on AXI VI... » read more

Tech Talk: Mobile Security (Part 1)
By Ed Sperling - 17 Mar, 2015 - Comments: 0

Simon Blake-Wilson, of Rambus' Cryptography Research Division, talks with Semiconductor Engineering about mobile security and how the risk will escalate with the IoT in banking, data centers, entertainment and devices themselves. [youtube vid=EJ75T-SEp4U] » read more

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