tag: reliability

Security At The Edge
By SE Staff - 29 Sep, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss security at the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus, Kris Ardis, executive director at Maxim Integrated; and Steve Roddy, vice president of Arm's Products Learning Group. What follows are excerpts of that conversation. To view part one of this discussion, click here. Part two i... » read more

Are Chips Getting More Reliable?
By Ed Sperling - 08 Sep, 2020 - Comments: 0

The semiconductor industry is making huge progress in understanding the causes and telltale signs of circuit aging and irregular behavior. But are devices actually getting more reliable? The answer depends on a number of factors, none of which is easily measured. To be sure, circuits are much better designed and inspected than in the past, and the individual components are printed more accur... » read more

Finding Defects With E-Beam Inspection
By Mark LaPedus - 20 Aug, 2020 - Comments: 0

Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these new e-beam inspection systems. One is a more traditional approach, which uses a single-beam e-beam system. Others, meanwhile, are developing newer multi-beam technology. Both approaches have thei... » read more

Mission Profiles In The Automotive Development Process
By Christoph Sohrmann - 13 Aug, 2020 - Comments: 0

The automotive industry's roadmap for the coming years is e-mobility and autonomous driving. Its implementation is likely to bring about changes on a par with the invention of the automobile itself. While the motor vehicle used to be primarily a mechanical product, it is now an entirely electronic system. Many of the new functions increase the safety of the driver and other road users, and t... » read more

Preparing For A Barrage Of Physical Effects
By Ann Mutschler - 13 Aug, 2020 - Comments: 0

Advancements in 3D transistors and packaging continue to enable better power and performance in a given footprint, but they also require more attention to physical effects stemming from both increased density and vertical stacking. Even in planar chips developed at 3nm, it will be more difficult to build both thin and thick oxide devices, which will have an impact on everything from power to... » read more

The Very Long Road To Autonomous Vehicles
By Ed Sperling - 11 Aug, 2020 - Comments: 0

It may be a long wait before fully autonomous vehicles hit the road. Even semi-autonomous vehicles aren't doing so well. The American Automobile Association drove 4,000 miles in cars equipped with active driver assistance, averaging problems every 8 miles. AAA cited a host of problems, including driving too close to other cars or guardrails, aggressive braking, and automated steering that wo... » read more

When You Can’t Afford To Scrimp On System Reliability
By Christine Young - 06 Aug, 2020 - Comments: 0

Failure happens, whether we like it or not. What’s important is to be prepared for failure to occur, which involves putting in place measures that allow us to quickly address or resolve the problem. But not all failures are created equally. For example, a laptop that you use daily might experience occasional glitches. If it’s well-designed, you can simply reset the machine to get it back to... » read more

Make Way For Flexible ICs
By Ed Sperling - 16 Jul, 2020 - Comments: 0

The push to develop intelligent sensors everywhere does not require everything to be on a silicon substrate. In fact, a growing part of the market increasingly is focused on flexible substrates. The market for printed sensors is roughly $3.6 billion today, according to a new report by IDTechEx. In a decade, that number is expected to grow to $4.5 billion, according to the firm, with growth i... » read more

Maximizing Value Post-Moore’s Law
By Brian Bailey - 13 Jul, 2020 - Comments: 0

When Moore's Law was in full swing, almost every market segment considered moving to the next available node as a primary way to maximize value. But today, each major market segment is looking at different strategies that are more closely aligned with its individual needs. This diversity will end up causing both pain and opportunities in the supply chain. Chip developers must do more with a ... » read more

Advanced Packaging Makes Testing More Complex
By Bryon Moyer - 07 Jul, 2020 - Comments: 1

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

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